5SGXMA7H1F35I2N

The 5SGXMA7H1F35I2N is a Stratix V GX field‑programmable gate array (FPGA) in a 1152‑BBGA FCBGA package, offered in an industrial temperature grade. It provides a high logic capacity device class with abundant embedded memory and a large number of I/O pins for complex, high‑density digital designs.

Designed for applications that require significant on‑chip logic and memory alongside high I/O counts, this device combines core logic density, approximately 51.2 Mbits of embedded memory, and 552 I/O to support demanding system integration requirements within an industrial operating range.

Key Features

• Logic Capacity — 622,000 logic elements (cells) providing substantial programmable logic resources for complex FPGA implementations.
• Embedded Memory — Approximately 51.2 Mbits of on‑chip RAM to store buffers, state machines, and large data structures without external memory.
• I/O Density — 552 user I/O pins to support extensive peripheral, interface, and mezzanine connectivity options.
• Package & Mounting — Supplied in a 1152‑BBGA (1152‑FBGA, 35×35) surface‑mount package for compact, board‑level integration.
• Power Supply — Core supply range specified from 870 mV to 930 mV to match system power‑rail design requirements.
• Temperature Grade — Industrial operating range from −40 °C to 100 °C for deployment in thermally demanding environments.
• Device Family Characteristics — As a Stratix V GX device, the family documentation describes GX transceiver speed grade options and electrical characteristics for high‑performance designs.

Typical Applications

• High‑density logic designs — Ideal for systems requiring large numbers of logic elements and on‑chip memory to implement complex finite state machines, DSP blocks, and custom datapaths.
• High‑I/O systems — Suited to designs that need extensive external interfacing or mezzanine connectivity thanks to 552 I/O pins.
• Industrial control and processing — The industrial temperature rating and robust power‑supply specification make the device applicable for industrial automation and embedded processing tasks.
• High‑performance FPGA platforms — Fits boards and modules that require sizable embedded memory and logic resources in a compact BGA package.

Unique Advantages

• High integration — Combines 622,000 logic elements with substantial embedded RAM to reduce reliance on external components and simplify PCB design.
• Large I/O capability — 552 I/O pins enable flexible system partitioning and broad peripheral support without additional bridge logic.
• Industrial robustness — Rated for −40 °C to 100 °C operation to meet tougher thermal environments common in industrial applications.
• Compact BGA footprint — 1152‑FBGA (35×35) package offers a space‑efficient form factor for high‑density boards and modules.
• Defined core supply window — 870 mV to 930 mV supply range provides clear design margins for power delivery and regulation on the target PCB.
• Documented family specifications — Supported by Stratix V device documentation that covers electrical, switching, and transceiver characteristics for system design validation.

Why Choose 5SGXMA7H1F35I2N?

The 5SGXMA7H1F35I2N positions itself as a high‑capacity Stratix V GX FPGA option that balances large programmable logic resources, significant embedded memory, and a high I/O count in a compact BGA package. Its industrial temperature rating and defined power requirements make it suitable for engineered systems that demand predictable electrical and thermal behavior.

Choose this device for designs that require substantial on‑chip resources and connectivity while relying on the Stratix V family documentation for electrical and transceiver characterization during system validation and integration.

Request a quote or submit an inquiry to receive pricing, availability, and additional technical assistance for integrating the 5SGXMA7H1F35I2N into your next design.