5SGXMA7H1F35I2WN

The 5SGXMA7H1F35I2WN is a Stratix® V GX FPGA in a 1152-BBGA (35×35) FCBGA package, optimized for high-density programmable logic and large embedded memory requirements. With 622,000 logic elements and approximately 51.2 Mbits of on-chip RAM, this industrial-grade device is suited to I/O‑rich designs and systems requiring extensive programmable logic and embedded memory resources.

Designed for board‑level integration, the device provides 552 user I/Os, a narrow supply voltage range (870 mV to 930 mV), surface‑mount packaging, and an extended operating range of −40 °C to 100 °C for industrial deployments.

Key Features

• Core Logic  622,000 logic elements (cells) to implement complex digital designs with high logic density.
• Embedded Memory  Approximately 51.2 Mbits of on‑chip RAM to support large buffers, FIFOs, and memory‑intensive processing.
• I/O Capacity  552 user I/Os to support wide datapaths, multiple peripherals, and extensive board connectivity.
• Power  Specified core supply range of 870 mV to 930 mV for controlled low‑voltage core operation.
• Package & Mounting  1152‑BBGA, FCBGA package (supplier device package: 1152‑FBGA 35×35) in a surface‑mount format for compact, high‑density PCB layouts.
• Temperature & Grade  Industrial grade with an operating temperature range of −40 °C to 100 °C for deployment in temperature‑challenging environments.
• Compliance  RoHS compliant to meet environmental and regulatory requirements.
• Stratix V GX Family Context  Part of the Stratix V family, which includes GX transceiver speed grades described in the device series documentation.

Typical Applications

• High‑density digital processing  Implementation of large FPGA designs requiring extensive logic and embedded memory for packet processing, signal processing, and algorithm acceleration.
• I/O‑intensive systems  Board designs needing a large number of user I/Os for parallel interfaces, high‑pin count peripherals, or complex I/O routing.
• Industrial embedded systems  Control and data acquisition applications that benefit from industrial temperature rating and robust surface‑mount packaging.
• Transceiver and serial link platforms  Systems leveraging the Stratix V GX family’s transceiver capabilities as documented in the series datasheet.

Unique Advantages

• High logic density: 622,000 logic elements provide the capacity to consolidate multiple functions into a single device, reducing board count and BOM complexity.
• Large on‑chip memory: Approximately 51.2 Mbits of embedded RAM supports deep buffering and memory‑heavy algorithms without external memory dependencies.
• Extensive I/O availability: 552 user I/Os enable flexible interfacing and support for broad system integration requirements.
• Industrial robustness: Rated for −40 °C to 100 °C operation, suitable for systems that require extended temperature performance.
• Compact, manufacturable package: 1152‑BBGA FCBGA in a 35×35 footprint provides high I/O and silicon density in a surface‑mount form factor.
• Regulatory compliance: RoHS compliance supports regulatory and environmental requirements for many product lines.

Why Choose 5SGXMA7H1F35I2WN?

This Stratix® V GX device combines high logic capacity, substantial embedded memory, and a large complement of user I/Os in a compact FCBGA package, making it a strong choice for complex, I/O‑dense, and memory‑intensive designs. Its industrial temperature rating and controlled core voltage range support deployment in demanding environments where reliability and predictable power behavior are required.

Engineers targeting scalable, high‑performance programmable solutions will find this device suitable for consolidating multi‑function systems, accelerating data paths, and reducing overall system complexity while relying on the established Stratix V series documentation and support resources.

Request a quote or submit an inquiry to evaluate 5SGXMA7H1F35I2WN for your next design and to obtain availability and pricing details.