5SGXMA7H2F35C1WN

The 5SGXMA7H2F35C1WN is a Stratix V GX family Field Programmable Gate Array (FPGA) in a high-density FCBGA package. It provides a large logic fabric, substantial on-chip memory, and a high I/O count, making it suited for designs that require dense programmable logic, significant embedded RAM, and extensive I/O connectivity.

Key Features

• Core Logic  Provides 622,000 logic elements to implement complex digital functions and large custom logic networks.
• Embedded Memory  Includes approximately 51.2 Mbits of embedded memory, enabling on-chip buffering, large LUT-based structures, and local data storage.
• I/O Capacity  Features 552 user I/Os to support wide parallel interfaces and diverse peripheral connectivity.
• Package and Mounting  Available in a 1152-BBGA FCBGA package (supplier package: 1152-FBGA, 35×35), optimized for surface-mount assembly in space-constrained designs.
• Power  Core voltage supply specified between 870 mV and 930 mV, enabling designers to plan power delivery and regulation requirements precisely.
• Commercial Grade Temperature  Rated for commercial operation from 0 °C to 85 °C, suitable for standard commercial and enterprise environments.
• Environmental Compliance  RoHS-compliant construction to support regulatory and manufacturing requirements.

Typical Applications

• High-density logic designs  Use the large logic element count for complex state machines, custom accelerators, and multi-function controllers.
• Memory-intensive processing  Leverage approximately 51.2 Mbits of embedded RAM for buffering, packet processing, and intermediate data storage.
• I/O-centric systems  Deploy in applications requiring many parallel or diverse interfaces, taking advantage of the 552 I/Os.
• Prototyping and system integration  Ideal for validating large FPGA-based systems and integrating multiple subsystems on a single silicon device.

Unique Advantages

• High logic density: 622,000 logic elements let you consolidate functions that would otherwise require multiple devices, reducing board-level complexity.
• Substantial on-chip memory: Approximately 51.2 Mbits of embedded RAM supports large data buffers and local working memory without external SRAM/DRAM.
• Extensive I/O connectivity: 552 I/Os provide flexibility for high-pin-count interfaces and mixed-signal front-end connections.
• Compact ball-grid package: The 1152-BBGA FCBGA package offers a high pin count in a compact footprint to save PCB area.
• Commercial temperature rating: Specified 0 °C to 85 °C operation for reliable performance in standard commercial environments.
• Regulatory readiness: RoHS compliance supports environmentally conscious manufacturing and assembly processes.

Why Choose 5SGXMA7H2F35C1WN?

The 5SGXMA7H2F35C1WN delivers a balance of high logic capacity, sizable embedded memory, and broad I/O resources in a compact FCBGA package. Its commercial-grade rating and defined core voltage range make it suitable for enterprise and commercial embedded systems that demand dense programmable logic and substantial on-chip RAM.

This device is a strong fit for engineering teams building complex FPGA-based platforms that require integration, scalability, and predictable electrical characteristics. The combination of logic density, embedded memory, and I/O capability supports consolidation of functions and streamlined system designs.

Request a quote or submit a pricing inquiry today to get availability and ordering information for the 5SGXMA7H2F35C1WN.