5SGXMA7H2F35C1N

The 5SGXMA7H2F35C1N is a Stratix V GX series Field Programmable Gate Array (FPGA) IC from Intel, delivered in a high-density 1152-BBGA FCBGA package (supplier package: 1152-FBGA, 35×35). It is a commercial-grade programmable logic device designed for applications that require substantial on-chip logic resources, embedded memory, and a large I/O count.

Key value propositions include very large logic capacity, significant embedded RAM, and a high I/O pin count—features that support complex logic integration within commercial temperature environments.

Key Features

• Core Logic  Approximately 622,000 logic elements for implementing large, complex digital designs.
• Embedded Memory  Approximately 51.2 Mbits of on-chip RAM (Total Ram Bits: 51,200,000) to support buffering, state storage, and large data paths without immediate reliance on external memory.
• I/O Capacity & Package  552 user I/O pins in a surface-mount 1152-BBGA, FCBGA package (supplier package: 1152-FBGA, 35×35) to support dense board-level connectivity.
• Power  Core voltage supply range of 870 mV to 930 mV for defined power-domain design.
• Commercial Temperature Grade  Rated for operation from 0 °C to 85 °C for commercial deployments.
• Mounting & Assembly  Surface-mount FCBGA package suitable for modern PCB assembly processes.
• Environmental Compliance  RoHS compliant for lead-free manufacturing requirements.

Typical Applications

• Complex digital processing  Leverage the device’s large logic element count and embedded memory for resource-intensive algorithm acceleration and data-path implementations.
• High-pin-count interfacing  Use the 552 I/O pins to implement multi-channel interfaces and dense peripheral connectivity without excessive multiplexing.
• Commercial networking and compute modules  Suitable for commercial-grade modules that require configurable logic, memory resources, and extensive I/O in a compact package.
• Prototyping and evaluation platforms  Provides the programmable capacity needed for validating large designs and system integration in commercial environments.

Unique Advantages

• High logic capacity: Approximately 622,000 logic elements enable integration of large, multi-function designs on a single device.
• Significant on-chip memory: ~51.2 Mbits of embedded RAM reduces dependence on external memory for many applications, simplifying BOM and board layout.
• Extensive I/O: 552 I/O pins support wide parallel interfaces and complex system connectivity with fewer external components.
• Compact, manufacturable package: 1152-BBGA (35×35) surface-mount package balances device density with PCB assembly compatibility.
• Commercial temperature rating: Specified 0 °C to 85 °C operation for commercial deployments and product lines.
• RoHS compliant: Supports lead-free production requirements and environmental standards.

Why Choose 5SGXMA7H2F35C1N?

The 5SGXMA7H2F35C1N delivers a combination of very large programmable logic resources, substantial embedded memory, and a high I/O count in a compact FCBGA package—making it well suited for commercial designs that require high integration density and flexible I/O. Its defined core voltage range and commercial temperature rating provide deterministic parameters for power and thermal planning.

This device is an appropriate choice for engineering teams building resource-intensive, commercially deployed systems that benefit from on-chip memory, large logic capacity, and broad connectivity while retaining RoHS compliance and surface-mount assembly compatibility.

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