5SGXMA7H2F35C2G

The 5SGXMA7H2F35C2G is a Stratix® V GX field programmable gate array (FPGA) from Intel designed for commercial-grade applications. It delivers high logic density and on-chip memory with a large I/O count in a 1152-ball BGA (FCBGA) package for surface-mount integration.

This device is suited for designs that require significant programmable logic capacity, substantial embedded memory, and expansive I/O capability while operating within a commercial temperature range.

Key Features

• Logic Capacity — 622000 logic elements provide substantial programmable logic resources for complex digital designs.
• Embedded Memory — Approximately 51.2 Mbits of on-chip RAM to support buffering, packet processing, and state storage without external memory.
• High I/O Count — 552 I/O pins enable broad connectivity options for parallel interfaces and multi-channel systems.
• Packaging & Mounting — 1152-BBGA, FCBGA package (supplier package: 1152-FBGA, 35×35) in a surface-mount form factor for dense board-level integration.
• Power Range — Voltage supply range of 870 mV to 930 mV to match platform power architectures.
• Commercial Temperature Grade — Rated for operation from 0 °C to 85 °C for standard commercial applications.
• RoHS Compliant — Conforms to RoHS environmental requirements for lead-free assembly.

Typical Applications

• High-density digital processing — Use the device’s large logic capacity and embedded RAM for compute-heavy FPGA tasks and custom datapath engines.
• Interface aggregation and bridging — The 552 I/O pins support multi-channel interfacing and protocol bridging in communication systems and complex I/O subsystems.
• Hardware prototyping and system integration — Surface-mount 1152-BBGA packaging and dense logic resources allow integration into prototype and production PCBs that require compact, high-capacity FPGAs.

Unique Advantages

• Substantial on-chip resources — 622000 logic elements paired with approximately 51.2 Mbits of embedded memory reduce dependency on external logic and RAM, simplifying board design.
• Extensive I/O reach — 552 I/O pins give designers flexibility to implement multiple parallel interfaces and high-channel-count systems without external multiplexing.
• Compact, production-ready package — 1152-BBGA (35×35) surface-mount package supports dense PCB layouts while maintaining manufacturability for commercial deployments.
• Controlled power window — Defined voltage supply range (870 mV–930 mV) helps ensure predictable core power planning and system integration.
• Commercial-grade operating range — 0 °C to 85 °C rating aligns with standard commercial electronics deployments and environmental expectations.
• Regulatory compliance — RoHS compliance supports lead-free manufacturing processes and environmental requirements.

Why Choose 5SGXMA7H2F35C2G?

The 5SGXMA7H2F35C2G balances high logic density, significant embedded RAM, and a large I/O count in a production-ready 1152-BBGA surface-mount package. Its commercial temperature rating and defined supply range make it a stable choice for system designs that require robust programmable logic capacity and broad interfacing capability.

This device is well suited for engineering teams and procurement looking for a high-capacity Stratix V GX FPGA for complex digital designs, interface-rich systems, and integration into compact PCB layouts—backed by Intel’s Stratix V family documentation and device specifications.

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