5SGXMA7H2F35C2N

The 5SGXMA7H2F35C2N is a Stratix® V GX Field Programmable Gate Array (FPGA) IC from Intel, built for applications that require high logic density, substantial on-chip memory, and a large I/O count. The device is supplied in a 1152-BBGA (35×35) FCBGA package and is intended for commercial-grade operation.

With approximately 622,000 logic elements, around 51.2 Mbits of embedded memory, and 552 available I/Os, this Stratix V GX device targets complex system designs that need extensive programmable logic, significant embedded RAM, and broad connectivity while operating at a core supply between 870 mV and 930 mV.

Key Features

• Core Logic Capacity  Approximately 622,000 logic elements for high-density programmable logic implementation.
• Embedded Memory  Approximately 51.2 Mbits of on-chip RAM to support large buffering, lookup tables, and state storage.
• I/O Density  552 I/O pins to support wide parallel interfaces, extensive peripheral connectivity, and multi-channel I/O systems.
• Package & Mounting  1152-BBGA (FCBGA), supplier device package 1152-FBGA (35×35); surface-mount package suitable for compact, high-density board designs.
• Power Supply  Core voltage range specified from 870 mV to 930 mV to match low-voltage system architectures.
• Temperature & Grade  Commercial grade rated for 0 °C to 85 °C operation.
• Series Transceiver Offering (Stratix V GX)  The Stratix V GX family documentation describes GX transceiver speed grades (series-level detail) for high-speed serial channel support in select speed grades.
• Environmental Compliance  RoHS compliant.

Typical Applications

• Networking & Telecom  Leveraging high logic capacity and substantial I/O count for packet processing, line card functions, and protocol bridging where large programmable fabrics and connectivity are required.
• Data Acceleration & Processing  Large embedded memory and extensive logic resources support buffering, parallel processing kernels, and custom acceleration blocks for compute-heavy tasks.
• High‑I/O Systems  Systems requiring many parallel interfaces or multi-channel front‑ends can utilize the 552 I/Os and dense package footprint for compact board-level integration.
• Prototyping & System Integration  High logic element count and on-chip RAM make the device suitable for prototyping complex ASIC replacements or integrating multiple functions into a single FPGA fabric.

Unique Advantages

• High logic density:  Approximately 622,000 logic elements enable implementation of large, complex designs without immediate partitioning to multiple devices.
• Substantial on-chip RAM:  Approximately 51.2 Mbits of embedded memory reduces external memory dependence for many buffering and stateful functions.
• Extensive I/O resources:  552 I/Os provide design flexibility for broad peripheral and parallel interface support in a single-package solution.
• Compact, production-ready package:  1152-BBGA (35×35) surface-mount packaging supports high-density PCB layouts and standardized assembly flows.
• Commercial temperature rating:  Rated for 0 °C to 85 °C, suitable for a wide range of commercial and enterprise applications.
• RoHS compliant:  Meets environmental requirements for lead‑free assemblies.

Why Choose 5SGXMA7H2F35C2N?

This Stratix V GX FPGA combines a very large programmable fabric, significant embedded memory, and a high number of I/Os in a single 1152-BBGA package, making it a solid choice for designers building dense, feature-rich systems. Its specified core voltage range and commercial temperature grade make it compatible with modern low-voltage, performance-oriented designs.

The device is well suited to teams needing a scalable, high-capacity FPGA for complex processing, heavy buffering, and broad connectivity, while benefiting from Intel’s Stratix V GX series documentation and device family characteristics.

If you would like pricing, availability, or to request a formal quote for part 5SGXMA7H2F35C2N, please submit a quote request or contact our sales support team for assistance.