5SGXMA7H2F35C3

The 5SGXMA7H2F35C3 is a Stratix® V GX family FPGA from Intel. It is a high-density, programmable logic device with integrated on‑chip memory and a large complement of general-purpose I/O, supplied in a 1152‑BBGA FCBGA package.

Targeted at designs that require substantial logic capacity and embedded memory, the device provides a combination of core switching characteristics and transceiver capabilities described in the Stratix V device datasheet for the GX family.

Key Features

• Logic Capacity — 622,000 logic elements to implement large, complex programmable logic designs.
• Embedded Memory — Approximately 51.2 Mbits of on‑chip RAM for buffers, FIFOs, and on‑device data storage.
• I/O Resources — 552 user I/O pins to support wide parallel interfaces and mixed I/O requirements.
• Transceiver Series Information — Stratix V GX family documentation describes high‑speed transceiver speed grades (series documentation lists GX channel speeds up to 14.1 Gbps in certain speed grades).
• Power — Voltage supply range of 870 mV to 930 mV as specified for device operation.
• Package — Available in a 1152‑BBGA FCBGA package; supplier device package listed as 1152‑FBGA (35×35).
• Operating Range — Commercial grade device with an operating temperature range of 0 °C to 85 °C.
• Environmental — RoHS compliant.

Typical Applications

• High‑density programmable logic implementations — Leverage 622,000 logic elements and substantial embedded RAM for large FPGA designs and custom datapaths.
• High‑speed serial interface systems — Use Stratix V GX family transceiver capabilities (per series documentation) where fast serial links are required.
• Complex I/O and interface aggregation — 552 I/O pins enable wide parallel buses, multiport interfaces, and extensive board-level connectivity.

Unique Advantages

• High logic density: 622,000 logic elements provide the capacity to implement complex state machines, datapaths, and custom accelerators on a single device.
• Large embedded memory: Approximately 51.2 Mbits of on‑chip RAM reduces dependence on off‑chip memory for many buffering and storage needs.
• Extensive I/O: 552 user I/Os simplify board design when connecting multiple peripherals or parallel interfaces.
• Compact, industry-standard package: 1152‑BBGA (35×35) FCBGA packaging supports surface-mount assembly in space-constrained designs.
• Commercial grade and RoHS compliant: Designed for commercial temperature environments (0 °C to 85 °C) and compliant with RoHS requirements.

Why Choose 5SGXMA7H2F35C3?

The 5SGXMA7H2F35C3 positions itself for projects that demand significant programmable logic density, substantial embedded memory, and broad I/O capability in a single, surface‑mount FPGA package. It is well suited for designers who need to consolidate complex logic functions and on‑chip storage while adhering to commercial temperature and RoHS requirements.

Backed by the Stratix V family documentation, the device benefits from detailed electrical and switching characteristic guidance for system integration and power planning. This makes it a practical choice for teams building large, high‑performance FPGA-based systems that rely on documented device behavior and established design references.

Request a quote or submit a pricing inquiry to obtain availability and lead-time information for the 5SGXMA7H2F35C3.