5SGXMA7H2F35C2NCV

IC FPGA 552 I/O 1152FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 552 51200000 622000 1152-BBGA, FCBGA

Quantity 860 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGA, FCBGANumber of I/O552Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs234720Number of Logic Elements/Cells622000
Number of GatesN/AECCNOBSOLETEHTS CodeN/A
QualificationN/ATotal RAM Bits51200000

Overview of 5SGXMA7H2F35C2NCV – Stratix® V GX FPGA, 1152-BBGA (FCBGA)

The 5SGXMA7H2F35C2NCV is a Stratix® V GX field-programmable gate array (FPGA) IC from Intel, presented in a 1152‑BBGA (FCBGA) package. It delivers a high count of programmable logic resources, on-chip memory, and a large number of I/O pins for complex digital designs.

This commercial-grade device provides 622,000 logic elements and approximately 51.2 Mbits of embedded memory, with a specified core voltage range of 870 mV to 930 mV and an operating temperature range of 0 °C to 85 °C, suitable for a broad set of high-density programmable logic applications.

Key Features

  • Core Capacity 622,000 logic elements and 234,720 logic array blocks for implementing large-scale programmable logic and complex datapaths.
  • Embedded Memory Approximately 51.2 Mbits of on-chip RAM to support buffering, state machines, and local storage without external memory in many use cases.
  • I/O Resources 552 available I/O pins to support extensive external interfacing and complex board-level connectivity.
  • Power and Voltage Core supply specified between 870 mV and 930 mV for defined power planning and regulator design.
  • Package and Mounting 1152‑BBGA (FCBGA) package; supplier device package listed as 1152‑FBGA (35×35). Surface-mount mounting type for PCB assembly.
  • Temperature Grade Commercial grade with an operating range of 0 °C to 85 °C.
  • Environmental Compliance RoHS compliant.

Unique Advantages

  • High logic density: 622,000 logic elements enable consolidation of complex functions onto a single device, reducing board-level component count.
  • Substantial on-chip memory: Approximately 51.2 Mbits of embedded RAM simplifies local data storage and accelerates on-chip processing.
  • Extensive I/O capacity: 552 I/O pins provide flexibility for multi-interface designs and high-pin-count system integration.
  • Compact FCBGA package: 1152‑BBGA (35×35) packaging balances density and board footprint for high-performance system designs.
  • Defined power envelope: Core voltage range of 870 mV–930 mV supports precise power-supply design and thermal planning.
  • Regulatory readiness: RoHS compliance supports environmentally conscious product design and manufacturing.

Why Choose 5SGXMA7H2F35C2NCV?

The 5SGXMA7H2F35C2NCV is positioned for designers needing a commercial‑grade, high-density Stratix® V GX FPGA with a large logic fabric, significant embedded memory, and a high I/O count in a compact FCBGA package. Its specifications support complex programmable logic tasks while providing clear electrical and thermal parameters for system integration.

This device is appropriate for development teams seeking to consolidate functionality, manage on-chip memory requirements, and accommodate extensive external connectivity, all with RoHS-compliant packaging and commercial operating range assurances.

Request a quote or submit an inquiry to obtain pricing and availability for the 5SGXMA7H2F35C2NCV and to discuss how this Stratix® V GX FPGA can fit your next design.

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