5SGXMA7H2F35C2LG

The 5SGXMA7H2F35C2LG is a Stratix® V GX Field Programmable Gate Array (FPGA) from Intel, delivered in a 1152-BBGA (35×35) FCBGA package for surface-mount applications. It provides a high logic capacity and on-chip memory with a large I/O count suitable for complex, connectivity‑heavy designs.

Key device attributes include 622,000 logic elements, approximately 51.2 Mbits of embedded memory, 552 general‑purpose I/Os, and a specified operating range of 0 °C to 85 °C. The device is commercial grade and RoHS compliant.

Key Features

• Core capacity  622,000 logic elements (logic element cells) to implement large, custom digital systems and algorithms.
• Embedded memory  Approximately 51.2 Mbits of total on‑chip RAM for buffering, look‑up tables, and data storage close to logic.
• I/O density  552 I/Os provide extensive external connectivity for high‑pin‑count designs and complex board interfaces.
• Power  Specified core voltage supply range of 820 mV to 880 mV for predictable power planning and regulation design.
• Package & mounting  1152‑BBGA FCBGA package (1152‑FBGA, 35×35) in a surface‑mount form factor to support compact board layouts.
• Temperature & grade  Commercial temperature grade with an operating range of 0 °C to 85 °C for mainstream embedded and industrial‑adjacent applications.
• Compliance  RoHS compliant package meets common environmental regulatory expectations.

Typical Applications

• High‑speed serial and transceiver systems  The Stratix V GX family is specified for transceiver and I/O timing capabilities, making this device appropriate for designs that rely on high‑throughput serial links and precise I/O timing.
• Data buffering and packet processing  Large embedded RAM (≈51.2 Mbits) and high logic capacity enable on‑chip packet manipulation, buffering, and protocol handling.
• Compute‑intensive logic and custom accelerators  622,000 logic elements support implementation of complex state machines, DSP chains, and parallel processing engines.
• I/O‑rich control and interface hubs  552 I/Os allow consolidation of multiple peripheral and interface functions onto a single FPGA for system simplification.

Unique Advantages

• High logic density: 622,000 logic elements give designers the headroom to implement large, integrated functions without immediate part upgrades.
• Substantial on‑chip RAM: Approximately 51.2 Mbits of embedded memory reduces external memory dependence and improves data throughput.
• Extensive I/O capability: 552 I/Os provide flexibility for complex board topologies and multiple high‑pin interfaces.
• Compact FCBGA package: 1152‑BBGA (35×35) packaging offers a balance of pin count and board area for dense designs.
• Predictable power envelope: Defined core supply range (820 mV–880 mV) helps streamline power‑supply design and thermal planning.
• Commercial grade and RoHS compliant: Suitable for mainstream embedded and commercial applications with standard environmental compliance.

Why Choose 5SGXMA7H2F35C2LG?

The 5SGXMA7H2F35C2LG delivers a combination of high logic capacity, significant embedded memory, and a large I/O complement in a compact 1152‑BBGA package. Its specification set is aimed at designers who need dense programmable logic and substantial on‑chip RAM for connectivity‑heavy or compute‑intensive applications within a commercial temperature range.

As part of the Stratix V GX family, this device aligns with documentation and electrical characteristics provided for the series, enabling engineering teams to design with well‑defined operating and I/O timing expectations.

Request a quote or submit an inquiry to discuss availability, pricing, and lead times for the 5SGXMA7H2F35C2LG.