5SGXMA7H2F35I2G

The 5SGXMA7H2F35I2G is an industrial‑grade Stratix V GX field programmable gate array offered in a 1152‑BBGA FCBGA package. It provides a high density of programmable logic and embedded memory along with a large number of general‑purpose I/O for complex, I/O‑intensive designs.

This device is suited for applications that require significant on‑chip logic capacity, large embedded memory resources, and extended temperature operation down to –40 °C, with verified RoHS compliance for regulatory alignment.

Key Features

• High Logic Density  Provides 622,000 logic elements for implementing large digital designs and complex FPGA architectures.
• Logic Array Capacity  Includes 234,720 logic blocks to structure and partition large designs efficiently on‑chip.
• Embedded Memory  Offers approximately 51.2 Mbits of embedded memory to support frame buffers, look‑up tables, and on‑chip data storage.
• Extensive I/O  Up to 552 user I/O pins enable broad peripheral connectivity and high channel counts for multi‑lane interfaces.
• Industrial Temperature Range  Rated for operation from –40 °C to 100 °C, suitable for industrial environments and extended thermal conditions.
• Power Supply  Core supply specified between 870 mV and 930 mV for the device core domain.
• Package & Mounting  1152‑BBGA (FBGA, 35×35) package; surface mount mounting type for modern PCB assembly flows.
• Environmental Compliance  RoHS compliant, supporting regulatory and manufacturing requirements.

Typical Applications

• Industrial Control & Automation  Large logic capacity and industrial temperature rating make it suitable for programmable controllers, motion control and factory automation systems.
• High‑Density Signal Processing  Extensive logic and embedded memory support real‑time DSP pipelines and multi‑channel data processing.
• Communications & Networking  High I/O count enables multi‑lane interfaces and dense port aggregation for network equipment and protocol bridging.
• Custom Hardware Acceleration  Large logic and memory resources allow implementation of application‑specific accelerators and hardware offload engines.

Unique Advantages

• Substantial on‑chip resources: The combination of 622,000 logic elements and approximately 51.2 Mbits of embedded memory enables integration of complex functions without external SRAM reliance.
• Large I/O footprint: 552 I/O pins allow flexible system partitioning and support for multiple interfaces or parallel data lanes.
• Industrial‑grade operation: Rated from –40 °C to 100 °C to meet extended temperature demands in industrial deployments.
• Compact, assembly‑ready package: 1152‑BBGA (35×35) surface mount package provides a high‑density footprint for space‑constrained PCBs.
• Controlled core voltage: Narrow core supply range (870–930 mV) supports stable, regulated power design for predictable device behavior.
• Regulatory readiness: RoHS compliance simplifies environmental conformity for manufacturing and distribution.

Why Choose 5SGXMA7H2F35I2G?

The 5SGXMA7H2F35I2G positions itself as a high‑density, industrial‑grade Stratix V GX FPGA option for designs that require significant programmable logic, substantial embedded memory, and a large I/O complement in a compact package. Its specified operating temperature range, controlled core voltage, and RoHS compliance make it appropriate for robust, long‑lifecycle industrial applications.

Designers and system integrators targeting complex signal processing, multi‑lane communications, or custom hardware acceleration will find the resource mix and packaging of this device well suited to reduce external component count and consolidate functionality on a single FPGA platform.

Request a quote or submit a pricing and availability inquiry for the 5SGXMA7H2F35I2G to receive detailed lead‑time and ordering information.