5SGXMA7H2F35I2LG

The 5SGXMA7H2F35I2LG is a Stratix® V GX field programmable gate array (FPGA) in a 1152-ball FCBGA package. It delivers very high logic density and on-chip memory combined with a large I/O count for demanding industrial applications.

Designed for designs that require substantial programmable logic and high I/O integration, this device offers 622,000 logic elements, approximately 51.2 Mbits of embedded memory, and 552 I/Os while operating across an industrial temperature range and industry-standard surface-mount packaging.

Key Features

• High logic density — 622,000 logic elements for complex, highly parallel designs and large-scale logic integration.
• Significant on‑chip memory — Approximately 51.2 Mbits of embedded RAM to support buffering, frame storage, and large state machines without external memory.
• Extensive I/O — 552 user I/O pins to support broad peripheral connectivity and multi-channel interfaces.
• Package and mounting — 1152-ball FCBGA (35×35) surface-mount package for compact board-level integration and high-pin-count routing.
• Industrial temperature grade — Rated for operation from −40 °C to 100 °C for reliable performance in industrial environments.
• Core voltage range — Core supply voltage specified between 820 mV and 880 mV for predictable power delivery and thermal planning.

Typical Applications

• High-speed serial and communications systems — Large logic capacity and family transceiver options (Stratix V GX series) support designs requiring significant serial connectivity and protocol processing.
• High-density signal processing — Ample logic elements and embedded RAM enable complex DSP pipelines and realtime data handling on‑chip.
• Network and data infrastructure — High I/O count and on‑chip resources make the device suitable for interfacing, packet processing, and aggregation tasks in industrial network equipment.

Unique Advantages

• Large programmable fabric: 622,000 logic elements reduce reliance on multiple FPGAs, simplifying board design and lowering system-level BOM.
• Substantial embedded memory: Approximately 51.2 Mbits of on‑chip RAM supports deep buffering and complex state storage without external DRAM.
• High I/O integration: 552 I/Os enable multiple parallel interfaces and flexible board-level partitioning.
• Industrial operational range: −40 °C to 100 °C rating provides thermal headroom for deployment in factory automation and other industrial settings.
• Compact 1152-ball FCBGA package: High pin density in a 35×35 form factor supports dense PCB routing and modular product designs.

Why Choose 5SGXMA7H2F35I2LG?

This Stratix V GX device combines high logic density, substantial embedded memory, and a wide I/O count in an industrial-grade package, delivering a robust platform for complex, high-performance FPGA designs. It is well suited to engineering teams building systems that require large on‑chip resources and flexible interfacing while maintaining industrial temperature operation.

Choosing the 5SGXMA7H2F35I2LG provides designers with a scalable, high-capacity programmable device that aligns with demanding application requirements and provides predictable power and thermal parameters for system-level design.

Request a quote or submit an inquiry to check availability, lead time, and volume pricing for the 5SGXMA7H2F35I2LG.