5SGXMA7H2F35I3

The 5SGXMA7H2F35I3 is a Stratix V GX family FPGA providing a high-density programmable fabric with 622,000 logic elements and approximately 51.2 Mbits of embedded memory. Designed as an industrial-grade, surface-mount device in a 1,152‑ball FCBGA/FBGA package, it delivers large on-chip resources and extensive I/O for complex system integration.

As part of the Stratix V GX device family, the datasheet documents transceiver speed-grade options for GX channels (up to 14.1 Gbps in the family), enabling designs that require high-speed serial interfaces (refer to the device datasheet for speed-grade details).

Key Features

• High-density logic  Approximately 622,000 logic elements to implement large-scale digital designs and complex state machines.
• Embedded memory  Approximately 51.2 Mbits of on-chip RAM for buffering, packet processing, and on-chip data structures.
• I/O capacity  552 I/O pins to support wide parallel buses and numerous peripheral interfaces.
• Transceiver capability (family-level)  Stratix V GX devices include transceiver speed-grade options documented in the datasheet (GX channel speeds up to 14.1 Gbps for applicable speed grades).
• Power supply  Core voltage supply specified between 820 mV and 880 mV, enabling predictable power design and regulation.
• Industrial temperature grade  Rated for operation from −40 °C to 100 °C for industrial environments.
• Package and mounting  1152‑BBGA / FCBGA (supplier package: 1152-FBGA 35×35) in a surface-mount form factor for compact, high-density board designs.
• Regulatory compliance  RoHS compliant.

Typical Applications

• High-density digital processing  Use the large logic-element count and substantial embedded memory to implement complex data-paths, protocol engines, and custom accelerators.
• Multi-interface systems  Leverage 552 I/O pins to connect multiple parallel buses, memory interfaces, and peripheral devices on a single FPGA.
• Industrial control and instrumentation  Industrial temperature grade and robust packaging support deployments in temperature-challenging environments requiring extended operating range.

Unique Advantages

• Highly integrated on-chip resources: The combination of ~622k logic elements and ~51.2 Mbits of embedded RAM reduces dependence on external components and simplifies board-level design.
• Large I/O footprint: 552 I/O pins enable dense system integration without sacrificing peripheral connectivity.
• Industrial temperature support: Specified −40 °C to 100 °C operation supports extended-environment deployment and design reuse across industrial applications.
• Predictable power requirements: A defined core voltage range of 820–880 mV simplifies regulator selection and power budgeting.
• Compact, manufacturable package: 1152‑ball FCBGA/FBGA surface-mount package provides high density while remaining compatible with standard assembly processes.
• RoHS compliant: Conforms to common environmental compliance requirements for commercial manufacturing.

Why Choose 5SGXMA7H2F35I3?

The 5SGXMA7H2F35I3 positions itself for designs that require substantial logic density, extensive on-chip memory, and a high I/O count in an industrial-temperature FPGA. With a clearly defined core voltage range and robust package options, it suits teams focused on scalable, long-lived system architectures where integration and predictable electrical characteristics are priorities.

Use this device when your design requires a large programmable fabric, significant embedded RAM, and many external interfaces while maintaining industrial-temperature operation and RoHS compliance. Refer to the Stratix V device datasheet for family-level transceiver speed-grade information and detailed electrical characteristics.

Request a quote or submit an inquiry to obtain pricing, availability, and technical support for the 5SGXMA7H2F35I3. Our team can provide package, ordering, and delivery information to help you move from evaluation to production.