5SGXMA7H2F35I3LN

The 5SGXMA7H2F35I3LN is a Stratix V GX field programmable gate array (FPGA) IC from Intel, delivered in a 1152‑ball FCBGA package. It combines a large programmable fabric, abundant I/O, and industrial temperature grading for demanding embedded and communication applications.

Designed for systems that require substantial logic density, on‑chip memory, and high I/O count, this device is positioned for high‑performance networking, compute acceleration, and industrial instrumentation where robust operating range and integration matter.

Key Features

• Core Logic  Approximately 622,000 logic elements enable complex digital designs and large-scale integration of custom processing functions.
• Embedded Memory  Approximately 51.2 Mbits of on‑chip RAM for buffering, lookup tables, and embedded data storage.
• I/O Capacity  552 user I/Os provide flexible connectivity for high‑pin‑count interfaces and multiple parallel buses.
• Power and Voltage  Core supply range specified at 820 mV to 880 mV for the device core voltage domain.
• Package & Mounting  1152‑FBGA (35×35 mm) FCBGA package, surface‑mount for compact board integration.
• Operating Range & Grade  Industrial temperature grade with an operating range of −40 °C to 100 °C for deployment in harsh environments.
• Standards Compliance  RoHS‑compliant construction for environmental and regulatory requirements.
• Stratix V GX Family Characteristics  Part of the Stratix V GX device family described in the Stratix V device datasheet, which provides details on electrical characteristics, transceiver and core performance, and I/O timing for this device class.

Typical Applications

• High‑speed communications  Use the Stratix V GX device family’s transceiver-capable fabric and high I/O count for network switching, line cards, and protocol bridging.
• Data center acceleration  Large logic capacity and on‑chip RAM support custom accelerators, packet processing, and inline data manipulation tasks.
• Industrial control and instrumentation  Industrial temperature grade and extensive I/O make this FPGA suitable for factory automation, test equipment, and instrumentation systems.
• Multi‑interface bridging  High I/O count and dense logic enable consolidation of multiple peripheral interfaces and custom glue logic in a single device.

Unique Advantages

• High logic density: A large pool of logic elements allows integration of complex state machines, DSP functions, and custom processors on a single device.
• Substantial embedded memory: Approximately 51.2 Mbits of on‑chip RAM reduce the need for external memory for many buffering and lookup tasks.
• Extensive connectivity: 552 I/Os provide the flexibility to support numerous parallel interfaces and high‑pin‑count applications without external multiplexing.
• Industrial readiness: −40 °C to 100 °C operating range and industrial grade classification support deployment in temperature‑challenging environments.
• Compact deployment: 1152‑FBGA (35×35) FCBGA package offers a dense packaging solution for space‑constrained PCBs while maintaining high pin count.
• Regulatory compliance: RoHS compliance supports regulatory requirements for electronics manufacturing and end products.

Why Choose 5SGXMA7H2F35I3LN?

The 5SGXMA7H2F35I3LN delivers a balance of large programmable fabric, significant on‑chip memory, and extensive I/O in a compact FBGA package suitable for industrial deployments. As part of the Stratix V GX family, it aligns with documented electrical and switching characteristics for designers targeting high‑performance communication and compute‑oriented systems.

Engineers and procurement teams seeking a high‑density, industrial‑grade FPGA with robust I/O capacity and on‑chip RAM will find this device suitable for integrating complex functions while minimizing external component count and board area.

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