5SGXMA7H2F35I3N

The 5SGXMA7H2F35I3N is a Stratix V GX field-programmable gate array (FPGA) in a 1152-BBGA (1152-FBGA 35×35) package. It provides very large programmable logic capacity, substantial embedded memory, and a high I/O count for demanding, high-density designs.

Designed as an industrial-grade device, this FPGA combines 622,000 logic elements with approximately 51.2 Mbits of on-chip RAM and 552 user I/Os, delivered in a surface-mount, RoHS-compliant package for use across robust systems that require extended temperature operation and tight integration.

Key Features

• High-density logic — 622,000 logic elements to implement large-scale digital designs and consolidate multiple functions into a single device.
• Embedded memory — Approximately 51.2 Mbits of on-chip RAM for large buffering, state storage, and memory-intensive logic.
• Extensive I/O — 552 user I/Os to support complex board-level interfacing and high pin-count connectivity requirements.
• Industrial temperature range — Rated for operation from −40 °C to 100 °C to support deployments in industrial environments.
• Core supply range — Voltage supply specified at 820 mV to 880 mV for the FPGA core.
• Package and mounting — Surface-mount 1152-BBGA (supplier package: 1152-FBGA, 35×35) for high-density PCB designs.
• Regulatory compliance — RoHS-compliant device suitable for manufacturing processes requiring lead-free components.

Typical Applications

• High-density digital systems — Consolidate multiple processing blocks and implement complex logic functions using the device’s large logic and memory resources.
• Multi-interface controllers — Leverage the 552 I/Os for interfacing with numerous peripherals, sensors, and subsystems on a single PCB.
• Industrial equipment — Use in control and automation systems that require industrial temperature operation and robust, surface-mount packaging.

Unique Advantages

• Large programmable capacity: 622,000 logic elements enable implementation of large, integrated designs and reduce the need for multiple FPGAs.
• Substantial on-chip memory: Approximately 51.2 Mbits of embedded RAM supports deep buffering and state storage without external memory dependence.
• High pin-count I/O: 552 user I/Os provide flexibility for dense, multi-channel connectivity and complex board-level routing.
• Industrial-grade operation: −40 °C to 100 °C rating addresses a wide range of environmental conditions common in industrial deployments.
• Compact BGA package: 1152-FBGA (35×35) surface-mount package supports high-density PCB layouts while maintaining serviceable I/O counts.
• RoHS compliance: Facilitates compliant manufacturing and integration into modern, lead-free product assemblies.

Why Choose 5SGXMA7H2F35I3N?

The 5SGXMA7H2F35I3N positions itself as a high-density, industrial-grade Stratix V GX FPGA that balances large logic capacity, significant embedded memory, and extensive I/O in a compact BGA package. Its specified operating range and RoHS compliance make it suitable for demanding system designs requiring reliability and integration.

This device is well suited for engineering teams consolidating complex functions into a single programmable device, where minimizing board-level component count, maintaining high I/O density, and supporting extended temperature operation are priorities.

Request a quote or submit a request for pricing and availability to get started with the 5SGXMA7H2F35I3N for your next high-density FPGA design.