5SGXMA7H2F35I3WN

The 5SGXMA7H2F35I3WN is a Stratix V GX field programmable gate array (FPGA) from Intel, delivered in a 1152-BBGA FCBGA package. It provides a high-density programmable fabric with large embedded memory and a high I/O count for complex digital designs in industrial environments.

Designed for applications that demand substantial on-chip logic, substantial embedded RAM, and broad I/O connectivity, this device targets high-throughput systems and industrial-grade deployments where temperature range and power rails are defined.

Key Features

• Logic Capacity  622,000 logic elements (cells) to support complex custom logic implementations and large FPGA designs.
• Embedded Memory  Approximately 51.2 Mbits of on-chip RAM (Total Ram Bits: 51,200,000) for buffering, lookup tables, and data storage within the fabric.
• I/O and Connectivity  552 user I/O pins to support wide parallel interfaces, multi-channel IO and large peripheral connectivity.
• Package and Mounting  1152-BBGA (FCBGA) 35×35 supplier device package suitable for surface-mount PCB assembly.
• Power and Operating Conditions  Core supply voltage range from 820 mV to 880 mV; rated operating temperature range from −40°C to 100°C for industrial-grade deployment.
• Industrial Grade  Supplied and specified as an industrial grade device appropriate for demanding temperature environments.
• Series Transceiver Capability (series-level)  As a Stratix V GX family device, the series supports multiple transceiver speed grades documented in the device datasheet; consult series documentation for transceiver-grade options and electrical characteristics.
• RoHS Compliant  Device meets RoHS compliance as specified in the product data.

Typical Applications

• Telecommunications & Networking  High logic capacity, large embedded memory, and many I/O pins enable packet processing, protocol bridging, and network interface implementations.
• Industrial Control Systems  Industrial-grade temperature rating and robust I/O count support factory automation, motion control, and real-time processing in harsh environments.
• Signal Processing and Acceleration  Large on-chip RAM and abundant logic make the device suitable for custom DSP pipelines, data aggregation, and throughput-focused processing tasks.
• Prototyping and Complex FPGA Designs  High-density logic and memory resources support advanced system prototyping and integration of multiple subsystems on a single device.

Unique Advantages

• High integration density: 622,000 logic elements reduce the need for multiple devices by consolidating large designs into a single FPGA.
• Substantial on-chip memory: Approximately 51.2 Mbits of embedded RAM enables deep buffering and local data storage without external memory in many use cases.
• Extensive I/O capability: 552 I/Os provide flexible interfacing for parallel buses, multi-channel I/O, and complex subsystem interconnects.
• Industrial operating range: Rated from −40°C to 100°C, supporting deployments where extended temperature tolerance is required.
• Compact FCBGA package: 1152-ball FCBGA (35×35) offers a compact, surface-mount solution for high-density PCB designs.
• Documented series characteristics: Backed by Stratix V family electrical and switching characteristic documentation to guide system-level design and qualification.

Why Choose 5SGXMA7H2F35I3WN?

The 5SGXMA7H2F35I3WN positions itself as a high-density, industrial-grade Stratix V GX FPGA offering substantial logic, embedded memory, and I/O resources in a compact FCBGA package. It is well suited to engineers building complex, throughput-oriented digital systems that require consolidated logic and on-chip storage within a controlled power and temperature window.

For teams targeting scalable FPGA implementations or consolidating multi-function systems into a single device, this FPGA delivers verifiable resources and series-level documentation to support design planning and integration.

If you need pricing, availability or a formal quote for the 5SGXMA7H2F35I3WN, request a quote or submit a technical inquiry to obtain current commercial and procurement details.