5SGXMA7H2F35I3G

The 5SGXMA7H2F35I3G is an Intel Stratix V GX FPGA in a 1152-BBGA (1152-FBGA, 35×35) package, supplied for surface-mount assembly. This industrial-grade device provides very large logic capacity and substantial on-chip memory for complex, high-density FPGA designs.

Designed for applications that require significant programmable logic, high I/O count, and robust operating conditions, the device combines 622,000 logic elements with approximately 51.2 Mbits of embedded RAM and 552 user I/Os to support demanding system implementations.

Key Features

• Logic Capacity  622,000 logic elements (cells) to implement large FPGA designs and complex custom hardware functions.
• Embedded Memory  Approximately 51.2 Mbits of on-chip RAM to support buffering, packet classification, lookup tables, and other memory-intensive functions.
• I/O Density  552 user I/O pins to enable wide external interfacing for multi-channel systems and dense connectivity.
• Package  1152-BBGA (1152-FBGA, 35×35) surface-mount package to support board-level integration in space-constrained designs.
• Voltage Supply  Core supply range 820 mV to 880 mV for defined power rail design and system integration.
• Operating Temperature  Industrial-grade operation from –40 °C to 100 °C for use in temperature-challenging environments.
• Compliance  RoHS compliant, supporting environmental and manufacturing requirements.

Typical Applications

• Industrial Control and Automation  Leverage the industrial temperature rating and high logic capacity for real-time control, motion control, and complex automation tasks.
• High-Density Prototyping and Custom Hardware  Use the large number of logic elements and abundant embedded memory for prototyping ASIC replacements, custom accelerators, and compute offloads.
• Communications and Networking Equipment  High I/O count and substantial on-chip RAM support packet processing, protocol bridging, and board-level connectivity functions.

Unique Advantages

• High Logic Integration: 622,000 logic elements allow consolidation of multiple functions into a single device, reducing board-level component count.
• Substantial On-Chip Memory: Approximately 51.2 Mbits of embedded RAM provides local buffering and fast access for data-path and control logic.
• Robust I/O Capability: 552 user I/Os accommodate wide external interfacing and multiple parallel channels without extensive multiplexing.
• Industrial Reliability: Rated for –40 °C to 100 °C operation to meet the needs of temperature-demanding installations.
• Compact Surface-Mount Package: 1152-BBGA (35×35) package supports high-density PCB layouts while maintaining a high pin count.
• Environmentally Compliant: RoHS compliance supports modern manufacturing and regulatory requirements.

Why Choose 5SGXMA7H2F35I3G?

The 5SGXMA7H2F35I3G positions itself as an industrial-grade, high-capacity FPGA suitable for complex designs that require extensive programmable logic, large embedded memory, and a high number of I/Os. Its combination of logic density and memory makes it appropriate for system-level integration where consolidating functionality into a single device reduces BOM and board complexity.

For engineering teams building industrial systems, communications hardware, or custom accelerators, this Stratix V GX device offers the scalability, thermal range, and interface density to support robust, long-term deployments while aligning with standard power and packaging requirements.

Request a quote or submit a pricing inquiry to confirm availability, lead times, and volume pricing for the 5SGXMA7H2F35I3G.