5SGXMA7H2F35I2N

The 5SGXMA7H2F35I2N is a Stratix V GX field programmable gate array (FPGA) IC from Intel, supplied in a 1152-BBGA FCBGA package (supplier package: 1152-FBGA, 35×35). It delivers a high-capacity programmable fabric with 622,000 logic elements and approximately 51.2 Mbits of on-chip RAM for complex digital designs.

Designed for industrial-grade deployments, this device provides extensive I/O (552 pins), a defined core voltage range, and a wide operating temperature window to support demanding embedded, communications, and industrial applications where integration density and robust operation are required.

Key Features

• Core Capacity – 622,000 logic elements to implement large, complex logic functions and system-on-chip level designs.
• Embedded Memory – Approximately 51.2 Mbits of on-chip RAM for buffering, packet processing, and intermediate data storage.
• I/O Resources – 552 I/O pins providing broad connectivity options for external interfaces and high pin-count systems.
• Transceiver Capability (series) – The Stratix V GX family includes transceiver speed grade options; series documentation lists channel speeds up to 14.1 Gbps for GX devices.
• Power Supply – Core voltage supply range of 870 mV to 930 mV for planning power delivery and thermal budgets.
• Package – 1152-BBGA, FCBGA (supplier package: 1152-FBGA, 35×35) for high-density routing and board-level integration.
• Temperature & Grade – Industrial grade device rated for operation from −40 °C to 100 °C.
• Environmental Compliance – RoHS compliant.

Typical Applications

• High-speed communications and networking – Leverages series transceiver capabilities and abundant I/O to implement protocol engines, line cards, and packet processing functions.
• Data center and compute acceleration – Large logic capacity and on-chip memory enable hardware acceleration blocks and custom offload functions.
• Signal processing and instrumentation – Ample logic elements and embedded RAM support DSP pipelines, real-time processing, and measurement systems.
• Industrial automation and control – Industrial grade temperature range and high I/O count make the device suitable for robust control, monitoring, and interface aggregation tasks.

Unique Advantages

• High integration density: 622,000 logic elements reduce the need for external ASICs or multiple FPGAs in many system designs.
• Substantial on-chip memory: Approximately 51.2 Mbits of embedded RAM supports large buffers and local data storage for low-latency processing.
• Extensive interfacing: 552 I/O pins provide flexibility to connect multiple peripherals, lanes, and external memories without extensive multiplexing.
• Industrial readiness: Rated for −40 °C to 100 °C operation, suitable for industrial environments and extended-temperature deployments.
• High-pin-count package: 1152-BBGA (35×35) package enables dense PCB routing for complex multi-channel designs.
• Series-level transceiver options: Stratix V GX family documentation includes high-speed transceiver grades to address demanding serial link requirements.

Why Choose 5SGXMA7H2F35I2N?

The 5SGXMA7H2F35I2N combines large logic capacity, significant embedded memory, and a high I/O count in a single industrial-grade FPGA package, making it well suited to systems that require high integration and robust operation. Its package and electrical characteristics support complex board-level designs where space, connectivity, and thermal considerations are critical.

This device is positioned for engineers and teams developing advanced communications, compute acceleration, signal processing, and industrial control solutions that demand scalable logic resources and on-chip memory, backed by Intel’s Stratix V GX family documentation and specifications.

Request a quote or submit an inquiry to receive pricing, availability, and additional technical information for 5SGXMA7H2F35I2N.