5SGXMA7H2F35I2LN
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 552 51200000 622000 1152-BBGA, FCBGA |
|---|---|
| Quantity | 225 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 552 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 234720 | Number of Logic Elements/Cells | 622000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 51200000 |
Overview of 5SGXMA7H2F35I2LN – Stratix® V GX Field Programmable Gate Array (FPGA) IC
The 5SGXMA7H2F35I2LN is a Stratix V GX FPGA optimized for high-density, high-performance programmable logic integration. It delivers a large logic fabric and substantial on-chip memory, making it suitable for designs that require extensive logic resources, high I/O counts, and industrial temperature operation.
Built on the Stratix V GX family architecture, this device targets applications that leverage abundant logic elements, embedded memory, and high-speed serial transceiver capability as described in the Stratix V device documentation.
Key Features
- Logic Capacity Provides 622,000 logic elements for large-scale programmable logic and complex system integration.
- Embedded Memory Approximately 51.2 Mbits of embedded memory to support buffering, large datasets, and on-chip storage.
- I/O Density Up to 552 user I/O pins to accommodate extensive external interfaces and high-pin-count board designs.
- Transceiver Options (Series) Stratix V GX devices include high-speed transceiver options (series datasheet lists multi-gigabit channel support depending on speed grade).
- Power and Core Voltage Core supply operating range of 820 mV to 880 mV for the device core power domain.
- Industrial Temperature Grade Rated for operation from –40 °C to 100 °C for deployment in industrial environments.
- Package and Mounting Supplied in a 1152-ball BBGA (FCBGA) package; supplier device package listed as 1152-FBGA (35×35). Surface mount type suitable for standard PCB assembly processes.
- Compliance RoHS-compliant.
Typical Applications
- High-speed Communications Use the device where multi-gigabit transceivers and high I/O count support network interfaces, line cards, and protocol bridging.
- Signal Processing Large logic capacity and substantial embedded memory enable complex DSP, video, and data-path implementations.
- Industrial Control and Test Equipment Industrial temperature grade and robust I/O make the part suitable for control systems, instrumentation, and automated test platforms.
Unique Advantages
- High logic density: 622,000 logic elements provide headroom for integrating multiple sub-systems and complex algorithms on a single device.
- Large on-chip memory: Approximately 51.2 Mbits of embedded memory reduces external memory dependence for buffering and data processing.
- Extensive connectivity: 552 I/Os enable broad peripheral interfacing and flexible board-level connectivity.
- Industrial temperature range: Rated from –40 °C to 100 °C for reliable operation in harsh environments.
- Compact, assembly-ready package: 1152-BBGA (35×35) surface-mount package balances density and board-space efficiency for compact system designs.
- Standards-compliant materials: RoHS compliance supports environmental and regulatory requirements.
Why Choose 5SGXMA7H2F35I2LN?
The 5SGXMA7H2F35I2LN is positioned for engineers who need substantial programmable logic, on-chip memory, and high I/O capacity in an industrial-grade FPGA. Its combination of 622,000 logic elements, approximately 51.2 Mbits of embedded memory, and 552 I/Os supports consolidated system designs that reduce board count and simplify signal routing.
Backed by the Stratix V GX device documentation, this FPGA is appropriate for designs that require high-density logic integration, multi-gigabit serial capabilities (per the Stratix V GX family), and robust thermal operation. It offers a scalable platform for medium- to high-complexity applications where long-term availability and design continuity are important.
Request a quote or submit a pricing and availability inquiry to receive detailed lead-time and ordering information for the 5SGXMA7H2F35I2LN.

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