5SGXMA7H2F35I2LN

IC FPGA 552 I/O 1152FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 552 51200000 622000 1152-BBGA, FCBGA

Quantity 225 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O552Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs234720Number of Logic Elements/Cells622000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits51200000

Overview of 5SGXMA7H2F35I2LN – Stratix® V GX Field Programmable Gate Array (FPGA) IC

The 5SGXMA7H2F35I2LN is a Stratix V GX FPGA optimized for high-density, high-performance programmable logic integration. It delivers a large logic fabric and substantial on-chip memory, making it suitable for designs that require extensive logic resources, high I/O counts, and industrial temperature operation.

Built on the Stratix V GX family architecture, this device targets applications that leverage abundant logic elements, embedded memory, and high-speed serial transceiver capability as described in the Stratix V device documentation.

Key Features

  • Logic Capacity  Provides 622,000 logic elements for large-scale programmable logic and complex system integration.
  • Embedded Memory  Approximately 51.2 Mbits of embedded memory to support buffering, large datasets, and on-chip storage.
  • I/O Density  Up to 552 user I/O pins to accommodate extensive external interfaces and high-pin-count board designs.
  • Transceiver Options (Series)  Stratix V GX devices include high-speed transceiver options (series datasheet lists multi-gigabit channel support depending on speed grade).
  • Power and Core Voltage  Core supply operating range of 820 mV to 880 mV for the device core power domain.
  • Industrial Temperature Grade  Rated for operation from –40 °C to 100 °C for deployment in industrial environments.
  • Package and Mounting  Supplied in a 1152-ball BBGA (FCBGA) package; supplier device package listed as 1152-FBGA (35×35). Surface mount type suitable for standard PCB assembly processes.
  • Compliance  RoHS-compliant.

Typical Applications

  • High-speed Communications  Use the device where multi-gigabit transceivers and high I/O count support network interfaces, line cards, and protocol bridging.
  • Signal Processing  Large logic capacity and substantial embedded memory enable complex DSP, video, and data-path implementations.
  • Industrial Control and Test Equipment  Industrial temperature grade and robust I/O make the part suitable for control systems, instrumentation, and automated test platforms.

Unique Advantages

  • High logic density: 622,000 logic elements provide headroom for integrating multiple sub-systems and complex algorithms on a single device.
  • Large on-chip memory: Approximately 51.2 Mbits of embedded memory reduces external memory dependence for buffering and data processing.
  • Extensive connectivity: 552 I/Os enable broad peripheral interfacing and flexible board-level connectivity.
  • Industrial temperature range: Rated from –40 °C to 100 °C for reliable operation in harsh environments.
  • Compact, assembly-ready package: 1152-BBGA (35×35) surface-mount package balances density and board-space efficiency for compact system designs.
  • Standards-compliant materials: RoHS compliance supports environmental and regulatory requirements.

Why Choose 5SGXMA7H2F35I2LN?

The 5SGXMA7H2F35I2LN is positioned for engineers who need substantial programmable logic, on-chip memory, and high I/O capacity in an industrial-grade FPGA. Its combination of 622,000 logic elements, approximately 51.2 Mbits of embedded memory, and 552 I/Os supports consolidated system designs that reduce board count and simplify signal routing.

Backed by the Stratix V GX device documentation, this FPGA is appropriate for designs that require high-density logic integration, multi-gigabit serial capabilities (per the Stratix V GX family), and robust thermal operation. It offers a scalable platform for medium- to high-complexity applications where long-term availability and design continuity are important.

Request a quote or submit a pricing and availability inquiry to receive detailed lead-time and ordering information for the 5SGXMA7H2F35I2LN.

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