5SGXMA7H2F35I3CV

The 5SGXMA7H2F35I3CV is an Intel Stratix V GX field programmable gate array (FPGA) offered in an industrial grade. It provides high-density programmable logic with 622,000 logic elements and approximately 51.2 Mbits of embedded RAM for complex, on-chip architectures.

Designed for surface-mount assembly in a 1152-BBGA (35×35) FCBGA package, this device delivers a large I/O count (552 I/Os) and supports an operating voltage range of 820 mV to 880 mV and an industrial operating temperature range of −40 °C to 100 °C.

Key Features

• Logic Resources  622,000 logic elements and 234,720 logic blocks provide extensive programmable fabric for large-scale designs.
• Embedded Memory  Approximately 51.2 Mbits of on-chip RAM for buffering, state storage, and embedded data structures.
• I/O Capacity  552 device I/Os to support complex parallel and serial interfacing across multiple subsystems.
• Transceiver Family Characteristics  Stratix V GX family transceiver characteristics and speed-grade options are provided in the device datasheet for system designers evaluating high-speed serial links.
• Power and Voltage  Core supply range of 820 mV to 880 mV for power budgeting and regulator selection.
• Package and Mounting  1152-BBGA, FCBGA (supplier package: 1152-FBGA, 35×35); surface-mount device suitable for standard PCB assembly processes.
• Temperature and Grade  Industrial grade with an operating temperature range of −40 °C to 100 °C for deployed systems requiring extended temperature operation.
• Environmental Compliance  RoHS compliant.

Typical Applications

• High-density logic integration  Use the large logic-element count and extensive fabric for consolidating multiple functions into a single FPGA design.
• On-chip buffering and memory-intensive logic  Approximately 51.2 Mbits of embedded RAM supports packet buffering, FIFOs, and complex state machines without external memory.
• Complex multi-I/O systems  With 552 I/Os, implement rich parallel interfaces, multi-protocol front-ends, or platform-level glue logic.

Unique Advantages

• Highly scalable logic capacity: 622,000 logic elements enable large designs to be implemented on a single device, reducing component count.
• Significant on-chip memory: Approximately 51.2 Mbits of embedded RAM reduces reliance on external memory for buffering and state retention.
• Large I/O count: 552 I/Os provide flexible board-level interfacing options and simplify integration of multiple peripherals and buses.
• Industrial temperature rating: −40 °C to 100 °C operation supports deployments in temperature-challenging environments.
• Compact, surface-mount package: 1152-BBGA (35×35) FCBGA enables high-density PCB layouts while retaining robust connectivity.
• Regulated supply window: 820 mV to 880 mV core voltage range assists in precise power delivery planning for system designers.

Why Choose 5SGXMA7H2F35I3CV?

The 5SGXMA7H2F35I3CV combines high logic density, large on-chip RAM, and substantial I/O resources in an industrial-grade Stratix V GX FPGA. Its package and electrical envelope make it appropriate for system designs that require consolidated logic, significant embedded memory, and a high pin count in a surface-mount form factor.

Engineers selecting this device benefit from a robust platform for scaling complex digital systems, with design parameters (voltage range, temperature rating, package, and RoHS compliance) that aid long-term deployment and manufacturability.

Request a quote or submit an inquiry to evaluate the 5SGXMA7H2F35I3CV for your next design and to obtain pricing, availability, and additional technical assistance.