5SGXMA7H2F35I3LG

The 5SGXMA7H2F35I3LG is an Intel Stratix V GX field programmable gate array in a 1152‑FBGA (35×35) surface‑mount package. It delivers high on‑chip logic capacity and embedded memory for complex digital designs that require large programmable fabric, substantial I/O, and industrial temperature operation.

Key device characteristics include 622,000 logic elements, approximately 51.2 Mbits of embedded memory, and 552 user I/Os, making this device suitable for demanding industrial and high‑density system applications where integration and thermal range are important design considerations.

Key Features

• Core Logic: 622,000 logic elements (logic element cells) to implement wide, complex digital logic and custom processing blocks.
• Embedded Memory: Approximately 51.2 Mbits of on‑chip RAM for buffering, FIFOs, and memory‑intensive functions.
• I/O Capacity: 552 user I/Os to support extensive peripheral connections, parallel buses, and multi‑lane interfaces.
• Power Supply: Core voltage supply range of 820 mV to 880 mV for the programmable fabric.
• Package & Mounting: 1152‑FBGA (35×35) package in a surface‑mount form factor for high‑density board designs.
• Temperature Grade: Industrial operating range from −40°C to 100°C for deployment in temperature‑demanding environments.
• Regulatory: RoHS compliant.

Typical Applications

• Industrial Control and Automation: Use the device’s high logic density and wide I/O count to implement control algorithms, protocol bridges, and I/O aggregation in industrial systems operating across a broad temperature range.
• High‑Density Digital Systems: Deploy the large embedded memory and logic resources for complex signal processing, packet buffering, or custom compute pipelines.
• Prototyping and System Integration: Leverage the Stratix V GX fabric for hardware prototyping or integration of multiple digital functions into a single programmable device.

Unique Advantages

• High Logic Density: 622,000 logic elements allow consolidation of multiple functions and deeper, more capable designs on a single device.
• Substantial On‑Chip Memory: Approximately 51.2 Mbits of embedded RAM reduces external memory dependence and simplifies system memory architectures.
• Extensive I/O Resources: 552 I/Os provide flexibility for interfacing with sensors, peripherals, and parallel or serial subsystems without large external glue logic.
• Industrial Temperature Rating: Specified −40°C to 100°C operation for reliability in harsh or variable environments.
• Compact FCBGA Packaging: 1152‑FBGA (35×35) package supports high routing density while maintaining a compact board footprint.
• Regulatory Compliance: RoHS compliance supports use in markets requiring restricted‑substance adherence.

Why Choose 5SGXMA7H2F35I3LG?

This Stratix V GX FPGA combines high logic capacity, significant embedded memory, and a large I/O complement in an industrial‑rated BGA package, offering a scalable platform for complex digital designs. It is well suited to engineers who need to integrate multiple functions, implement memory‑heavy logic, or support extensive external connections while maintaining operation across a wide temperature range.

Choosing this part provides a balance of integration and board‑level density that helps reduce system BOM and simplifies design partitioning for mid‑ to high‑complexity FPGA applications.

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