5SGXMA7H2F35I2WN

The 5SGXMA7H2F35I2WN is a Stratix® V GX field-programmable gate array (FPGA) from Intel, built to deliver very high logic density, substantial on-chip memory, and large I/O capacity in a surface-mount FCBGA package. This device is offered in an industrial temperature grade and is suitable for designs that require sustained operation across a wide thermal range.

Key attributes include 622,000 logic elements, approximately 51.2 Mbits of embedded memory, and 552 user I/Os, providing a platform for complex, high-density programmable logic implementations where integration and reliability are important.

Key Features

• Core and Logic  622,000 logic elements (logic cells) to implement large-scale programmable logic and complex datapaths.
• Embedded Memory  Approximately 51.2 Mbits of on-chip RAM for buffering, state storage, and memory-intensive logic functions.
• I/O Capacity  552 user I/Os to support wide connectivity and high-pin-count system interfaces.
• Power  Core voltage supply range of 870 mV to 930 mV for device operation.
• Package & Mounting  1152‑BBGA (FBGA/FCBGA) supplier package, 1152‑FBGA (35×35) footprint; surface-mount device suitable for standard PCB assembly.
• Temperature & Grade  Industrial grade with operating temperature range of −40 °C to 100 °C for extended environmental tolerance.
• Environmental Compliance  RoHS compliant.

Typical Applications

• High-density logic designs  Implement large-scale state machines, custom processors, and complex finite-state systems using the device's 622,000 logic elements and extensive embedded RAM.
• Buffered data handling and memory-intensive logic  Use the approximately 51.2 Mbits of on-chip RAM for packet buffering, FIFOs, and intermediate data storage in streaming or packetized systems.
• High‑pin-count interface systems  Leverage 552 I/Os to connect to multiple peripherals, parallel buses, or multi-lane I/O subsystems in dense board-level designs.
• Industrial environments  Deploy in systems that require industrial temperature operation (−40 °C to 100 °C) while maintaining high logic and I/O capacity.

Unique Advantages

• Large programmable capacity: 622,000 logic elements enable consolidation of multiple functions into a single device, reducing BOM count and board complexity.
• Significant on-chip memory: Approximately 51.2 Mbits of embedded RAM minimizes external memory dependencies for many buffering and storage needs.
• Extensive I/O availability: 552 user I/Os provide flexibility for wide parallel interfaces, multiple peripherals, and complex board-level routing.
• Industrial temperature operation: Rated from −40 °C to 100 °C to support deployments in demanding thermal environments.
• Surface-mount FCBGA package: 1152‑BBGA (35×35) package supports high-density board designs and standard SMT assembly processes.
• Regulatory readiness: RoHS compliance supports environmental and manufacturing requirements.

Why Choose 5SGXMA7H2F35I2WN?

The 5SGXMA7H2F35I2WN positions itself as a high-density Stratix V GX FPGA option for engineers needing substantial logic resources, abundant on-chip RAM, and wide I/O in an industrial-grade, surface-mount package. Its combination of 622,000 logic elements, approximately 51.2 Mbits of embedded memory, and 552 I/Os makes it suitable for complex, integrated designs where consolidation, connectivity, and thermal tolerance are priorities.

Designed for long-term designs that demand scalability and robustness, this device is appropriate for system designers evaluating platforms that require high integration and predictable electrical characteristics. For complete electrical and switching specifications, refer to the manufacturer’s Stratix V device documentation.

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