5SGXMA7H3F35C2

The 5SGXMA7H3F35C2 is a Stratix V GX family field programmable gate array (FPGA) offered in a commercial temperature grade. It combines high logic density, substantial on-chip memory, and a high I/O count in a 1152-ball FCBGA surface-mount package.

This device targets commercial designs that require large-scale programmable logic and system-level I/O integration, delivering a platform for complex digital functions while operating within a 0 °C to 85 °C temperature range and a core voltage supply of 870 mV to 930 mV.

Key Features

• Core Logic Density  Approximately 622,000 logic elements for large-scale, high-density programmable logic implementations.
• Embedded Memory  Approximately 51.2 Mbits of on-chip RAM to support data buffering, lookup tables, and intermediate processing storage.
• I/O Capacity  552 dedicated I/O pins to support complex board-level connectivity and multi-channel interfaces.
• Package & Mounting  1152-ball FCBGA package (supplier device package: 1152-FBGA, 35×35) with surface-mount mounting suitable for compact PCB designs.
• Power  Core voltage supply range of 870 mV to 930 mV to match platform power requirements and aid power budgeting.
• Temperature & Grade  Commercial grade device with an operating temperature range of 0 °C to 85 °C for standard commercial environments.
• Regulatory Compliance  RoHS compliant to meet common environmental and manufacturing requirements.

Typical Applications

• Communications & Networking  High logic density and extensive I/O allow implementation of packet processing, protocol bridging, and multi-channel interface logic in commercial communications equipment.
• High-density Digital Signal Processing  Large embedded RAM and abundant logic elements support DSP pipelines, buffering, and data-path heavy algorithms.
• System Integration in Commercial Electronics  The compact 1152-FBGA package and high I/O count enable consolidated system functions and board-level integration in commercial products.

Unique Advantages

• Highly integrated logic and memory: Integrates approximately 622,000 logic elements with ~51.2 Mbits of on-chip RAM to reduce external component needs.
• Extensive connectivity: 552 I/Os provide flexibility for complex interfacing and multiple parallel channels without immediate need for external expanders.
• Compact surface-mount package: 1152-FBGA (35×35) package enables dense PCB layouts while maintaining high pin count.
• Commercial-grade thermal profile: Rated for 0 °C to 85 °C operation to meet typical commercial deployment environments.
• Controlled power envelope: Core voltage range (870 mV–930 mV) allows predictable power planning for system designers.
• RoHS compliance: Simplifies environmental compliance for commercial manufacturing.

Why Choose 5SGXMA7H3F35C2?

The 5SGXMA7H3F35C2 delivers a high-density Stratix V GX FPGA solution for commercial applications that demand substantial programmable logic, significant embedded memory, and a high I/O count in a single surface-mount package. Its combination of approximately 622,000 logic elements, ~51.2 Mbits of RAM, and 552 I/Os makes it well suited for designs requiring dense integration and broad interface capability while operating within standard commercial temperature and power ranges.

Engineers selecting this part benefit from a documented device family and a platform that supports complex logic and memory requirements without adding unnecessary external components, enabling streamlined design and system-level consolidation.

Request a quote or submit an inquiry for pricing and availability of the 5SGXMA7H3F35C2 to move your design forward.