5SGXMA7H3F35C2N

The 5SGXMA7H3F35C2N is a Stratix® V GX field programmable gate array (FPGA) IC from Intel designed for demanding, high‑capacity FPGA implementations. It combines a large programmable fabric with abundant I/O and on‑chip memory to support complex logic, buffering, and high‑speed serial interfaces.

As a commercial‑grade Stratix V GX device, it targets high‑performance applications that require significant logic density, extensive embedded RAM, and GX transceiver capability as described in the Stratix V device documentation.

Key Features

• Programmable logic — 622,000 logic elements with 234,720 CLBs for large, complex designs and deep logic integration.
• Embedded memory — approximately 51.2 Mbits of on‑chip RAM to support buffering, DSP pipelines, and large state machines without external memory.
• I/O density — 552 user I/O pins to connect high‑pin‑count peripherals and system interfaces.
• Transceiver capability — part of the Stratix V GX family; Stratix V GX devices include transceiver speed grades (datasheet examples include up to 14.1 Gbps in some grades).
• Power and operating range — operating voltage range 870 mV to 930 mV and commercial temperature range 0 °C to 85 °C.
• Package and mounting — supplied in a high‑pin‑count 1152‑BBGA / FCBGA package (supplier package listed as 1152‑FBGA (35×35)); surface‑mount device for PCB assembly.
• Compliance — RoHS compliant.

Typical Applications

• High‑speed communications — leverage Stratix V GX transceiver speed grades for multi‑gigabit links and protocol bridging.
• Network and switching systems — large logic capacity and abundant I/O make the device suitable for packet processing, traffic management, and interface consolidation.
• Data processing and acceleration — extensive on‑chip RAM and logic resources support custom accelerators, deep buffering, and parallel datapaths.

Unique Advantages

• High logic capacity: 622,000 logic elements enable integration of large, system‑level functions on a single device, reducing component count.
• Large embedded memory: approximately 51.2 Mbits of RAM reduces dependence on external memory for many buffering and state storage needs.
• Generous I/O and package: 552 I/O in a 1152‑ball BGA package supports dense routing and multiple high‑speed interfaces.
• Designed for high‑speed links: GX family transceiver grades (documented up to 14.1 Gbps in the Stratix V GX family) provide headroom for multi‑Gbps serial connectivity.
• Commercial temperature and RoHS compliance: commercial grade (0 °C to 85 °C) and RoHS compliant for standard commercial deployments.

Why Choose 5SGXMA7H3F35C2N?

The 5SGXMA7H3F35C2N delivers a combination of large logic resources, substantial embedded RAM, and high I/O count in a Stratix V GX device package from Intel. It is well suited to engineers developing complex, high‑performance FPGA systems that require significant on‑chip capacity and multi‑gigabit serial connectivity options documented for the Stratix V GX family.

Choose this device for designs that need scalable logic density, extensive memory for on‑chip buffering, and the package pin count to accommodate multiple interfaces, while operating within a commercial temperature range and standard surface‑mount PCB workflows.

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