5SGXMA7H3F35C2NCV

The 5SGXMA7H3F35C2NCV is a commercial-grade Stratix® V GX Field Programmable Gate Array from Intel. It provides a high-density programmable fabric with an extensive I/O count and significant on‑chip memory for complex digital designs.

Key device attributes include 622,000 logic elements, approximately 51.2 Mbits of embedded memory, 552 I/Os, and a 1152-FBGA (35×35) surface-mount package, with a core supply range of 870 mV to 930 mV and an operating temperature range of 0 °C to 85 °C.

Key Features

• Core / Logic Capacity  622,000 logic elements (cells) provide a large programmable fabric for complex logic integration.
• Logic Array Blocks  234,720 logic array blocks (LABs) for structured logic partitioning and resource allocation.
• Embedded Memory  Approximately 51.2 Mbits of on-chip RAM for data buffering, FIFOs, and shared storage.
• I/O  552 general-purpose I/Os to support dense board-level interfacing and multi-domain connectivity.
• Package & Mounting  1152-FBGA (35×35) package in an FCBGA form factor with surface-mount mounting for standard assembly processes.
• Power  Core voltage supply range of 870 mV to 930 mV for defined power domain design.
• Temperature & Grade  Commercial grade, specified for operation from 0 °C to 85 °C.
• Environmental  RoHS compliant.

Typical Applications

• High-density digital systems  Implement complex logic and control functions using the device’s 622,000 logic elements and LAB resources.
• Memory‑intensive designs  Leverage approximately 51.2 Mbits of embedded RAM for buffering, packet processing, or on-chip data storage.
• Dense board-level I/O  Use 552 I/Os to connect to multiple peripherals, sensors, and high-pin-count interfaces without extensive external multiplexing.
• Commercial electronics  Deploy in commercial-temperature-range equipment where the 0 °C to 85 °C rating and RoHS compliance meet design requirements.

Unique Advantages

• High logic capacity: Enables integration of large, complex designs on a single device, reducing PCB count and system complexity.
• Substantial on-chip memory: Approximately 51.2 Mbits of embedded RAM supports large buffers and reduces dependence on external memory.
• Extensive I/O count: 552 I/Os provide flexibility for multi-interface designs and simplify board routing by minimizing external expanders.
• Standard FBGA package: 1152-FBGA (35×35) surface-mount package supports mainstream PCB assembly workflows.
• Commercial operating range: Rated for 0 °C to 85 °C, making it suitable for a broad range of commercial applications.
• Regulatory compliance: RoHS compliant for environmental and manufacturing requirements.

Why Choose 5SGXMA7H3F35C2NCV?

The 5SGXMA7H3F35C2NCV combines a large programmable fabric, substantial embedded memory, and a high I/O count in a compact FBGA package, making it well suited for complex commercial designs that require dense logic, on‑chip storage, and extensive interfacing. As a member of the Intel Stratix V GX family, it is supported by comprehensive device documentation to aid integration and system-level planning.

This device is appropriate for engineering teams building high-capacity, I/O-rich commercial systems that value integration and predictable operating specifications (core voltage and temperature range) for reliable deployment.

Request a quote or submit an inquiry to obtain pricing, lead time, and availability for the 5SGXMA7H3F35C2NCV.