5SGXMA7H3F35C3

The 5SGXMA7H3F35C3 is a Stratix V GX family FPGA in a 1152-BBGA FCBGA package designed for high-density digital implementations. It provides a large logic capacity, substantial on-chip RAM, and a high I/O count suitable for complex system designs in commercial-temperature environments.

This device targets designs that require extensive programmable logic, significant embedded memory, and many external interfaces, while operating from a core supply range of 0.820–0.880 V and within a commercial temperature range of 0 °C to 85 °C.

Key Features

• Core & logic capacity  622,000 logic elements (cells) for implementing large-scale digital logic and complex algorithms.
• Logic blocks (device listing)  234,720 (as specified in device data) to reflect the device’s internal logic structure.
• Embedded memory  Approximately 51.2 Mbits of on-chip RAM (51,200,000 bits) to support buffering, packet processing, and local data storage.
• High I/O count  552 user I/O pins for extensive peripheral and high-pin-count interface support.
• Power and core supply  Core voltage supply range specified at 820 mV to 880 mV for on-board power planning and regulator selection.
• Commercial-grade operation  Rated for 0 °C to 85 °C operating temperature; provided as a commercial-grade device.
• Package & mounting  1152-BBGA, FCBGA package; supplier device package listed as 1152-FBGA (35×35). Surface-mount mounting type for standard PCB assembly.
• Regulatory status  RoHS compliant.

Typical Applications

• High-density digital processing  Large logic capacity and extensive embedded RAM support complex combinational and sequential logic tasks, acceleration engines, and algorithm implementation.
• Interface aggregation  High I/O count enables consolidation of multiple external interfaces and peripherals in a single device footprint.
• System integration and prototyping  Commercial-grade operation and surface-mount packaging make the device suitable for development platforms and production designs within the specified temperature range.

Unique Advantages

• Substantial logic resources: 622,000 logic elements (cells) deliver the capacity needed for large-scale functions and multi-module integration.
• Large on-chip memory: Approximately 51.2 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage tasks.
• High external connectivity: 552 I/Os allow flexible interfacing and support for numerous external signals without additional hardware.
• Compact, production-ready package: 1152-BBGA FCBGA (1152-FBGA 35×35) with surface-mount mounting suits standard PCB assembly processes.
• Commercial operating spec: Rated for 0 °C to 85 °C and RoHS compliant for mainstream commercial applications and regulatory compliance planning.
• Well-defined power envelope: Core supply specified between 0.820 V and 0.880 V aids in power supply design and thermal planning.

Why Choose 5SGXMA7H3F35C3?

The 5SGXMA7H3F35C3 positions itself as a high-density Stratix V GX FPGA for commercial designs that require substantial programmable logic, a large embedded RAM footprint, and a high number of I/Os in a compact FCBGA package. Its specified core voltage range and commercial temperature rating make it straightforward to integrate into standard production systems.

This device suits engineers and teams building complex digital systems who need a combination of logic capacity, on-chip memory, and connectivity while maintaining compliance with RoHS requirements and conventional surface-mount assembly processes.

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