5SGXMA7H3F35C4

The 5SGXMA7H3F35C4 is a high‑density Stratix® V GX field‑programmable gate array (FPGA) in a 1152‑BBGA FCBGA package. It delivers large on‑chip logic capacity and embedded memory with a high I/O count, offered in a commercial temperature grade.

This device is intended for designs that require extensive programmable logic, substantial embedded RAM, and a dense I/O footprint while operating within a commercial 0 °C to 85 °C range.

Key Features

• High Logic Density — 622,000 logic elements to implement complex digital systems and large combinational/sequential designs.
• Embedded Memory — Approximately 51.2 Mbits of on‑chip RAM for buffering, packet storage, or LUT‑based architectures.
• I/O Capacity — 552 user I/O pins to support wide parallel interfaces and numerous peripheral connections.
• Power and Core Voltage — Core supply specified at 820 mV to 880 mV for the device's core power domain.
• Package & Mounting — 1152‑BBGA FCBGA (supplier package: 1152‑FBGA, 35x35) in a surface‑mount form factor for board‑level integration.
• Commercial Grade Operating Range — Rated for operation from 0 °C to 85 °C.
• Standards Compliance — RoHS compliant.
• Stratix V GX Family Capabilities — Series datasheet indicates Stratix V GX devices support multiple transceiver and core speed grades (see series documentation for transceiver options and speed grade details).

Typical Applications

• High‑density digital logic implementations — Suited for designs that require extensive programmable logic and complex finite state machines.
• On‑chip buffering and memory‑centric functions — Large embedded RAM supports packet buffering, FIFOs, and data staging within the FPGA fabric.
• High‑I/O interfacing — 552 I/O pins accommodate wide buses, parallel sensor interfaces, or multi‑bank peripheral connections.

Unique Advantages

• Large programmable fabric — 622,000 logic elements enable consolidation of multiple functions into a single FPGA, reducing component count.
• Significant embedded memory — Approximately 51.2 Mbits of on‑chip RAM minimizes external memory needs for many applications.
• High I/O density — 552 I/O pins allow flexible partitioning of interfaces and support for complex board designs.
• Compact, manufacturable package — 1152‑BBGA (35x35) surface‑mount package facilitates high‑density PCB layouts and automated assembly.
• Commercial temperature rating — Specified 0 °C to 85 °C operation for standard commercial deployments.
• RoHS‑compliant — Meets RoHS requirements for materials compliance.

Why Choose 5SGXMA7H3F35C4?

The 5SGXMA7H3F35C4 provides a balance of very high logic capacity, substantial embedded memory, and a large I/O count in a single Stratix V GX device. Its commercial temperature rating and surface‑mount 1152‑BBGA package make it suitable for compact, high‑function designs that need on‑chip resources and flexible I/O.

Designers seeking to consolidate system functions, reduce external memory, and implement complex logic within a single FPGA fabric will find this device appropriate. Refer to the Stratix V GX device documentation for series‑level details on speed grades and transceiver options.

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