5SGXMA7H3F35I3

The 5SGXMA7H3F35I3 is a Stratix V GX Field Programmable Gate Array (FPGA) device offering high logic capacity and extensive I/O in a ball-grid-array package. It targets designs that require large on-chip memory, a high count of programmable logic elements, and industrial temperature operation.

As a member of the Stratix V GX family, this device is part of a series documented for high-speed transceiver options and industrial/core speed grades in the Stratix V device datasheet.

Key Features

• Logic Capacity  622,000 logic elements provide large programmable logic resources for complex digital designs.
• Embedded Memory  Approximately 51.2 Mbits of on-chip RAM (51,200,000 total RAM bits) for buffering, lookup tables, and data path storage.
• I/O Resources  552 general-purpose I/O pins support wide connectivity options for system interfaces and parallel buses.
• High-speed Transceiver Series Characteristics  As part of the Stratix V GX family, the series documentation lists transceiver speed grades including up to 14.1 Gbps (C1) and 12.5 Gbps (other GX grades), per the Stratix V device datasheet.
• Power Supply Range  Core voltage supply specified between 820 mV and 880 mV to meet the device’s operating requirements.
• Industrial Temperature Range  Rated for operation from –40 °C to 100 °C for deployment in temperature-challenging environments.
• Package & Mounting  1152-ball BGA (FCBGA) package, supplier package noted as 1152-FBGA (35×35); surface-mount mounting supports standard PCB assembly processes.
• Regulatory Compliance  RoHS compliant.

Typical Applications

• High-density logic designs  Use the large pool of logic elements and on-chip RAM to implement complex state machines, pipelines, and custom accelerators.
• High-performance I/O systems  The 552 I/O pins allow broad connectivity for wide parallel interfaces, data aggregation, and board-level I/O routing.
• Industrial equipment  The –40 °C to 100 °C operating range and industrial grade designation suit applications exposed to wide temperature swings.

Unique Advantages

• Large programmable fabric: 622,000 logic elements deliver capacity to consolidate multiple functions into a single FPGA, reducing BOM and board area.
• Significant on-chip memory: Approximately 51.2 Mbits of embedded RAM lowers dependence on external memory for buffering and state storage.
• Extensive I/O count: 552 I/Os simplify interfacing to wide buses and multiple peripherals without additional I/O expanders.
• Industrial operating range: Rated from –40 °C to 100 °C for reliable operation in demanding thermal environments.
• Compact BGA packaging: 1152-ball FCBGA (35×35) enables high-density routing and a compact board footprint while being surface-mount compatible.
• Series-level high-speed transceiver support: Stratix V GX series documentation lists high transceiver speed grades, providing design options for high-throughput links.

Why Choose 5SGXMA7H3F35I3?

The 5SGXMA7H3F35I3 combines large logic capacity, substantial embedded memory, and a high I/O count in a surface-mount, 1152-ball FCBGA package rated for industrial temperatures. It is suited to designs that require consolidation of complex digital functions, significant on-chip buffering, and extensive external interfacing.

As a Stratix V GX family device, it aligns with series-level transceiver and speed-grade options documented in the device datasheet, offering designers a scalable platform backed by the Stratix V device documentation and specifications.

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