5SGXMA7H3F35I3G

The 5SGXMA7H3F35I3G is a Stratix V GX family FPGA from Intel, providing a high-density programmable fabric in an FCBGA package. This device combines a large logic element count with extensive on-chip memory and a high I/O count to address designs that require substantial programmable logic capacity and broad interfacing.

As a Stratix V GX device, the product is part of a family whose documentation includes transceiver and electrical characteristics. This specific device is supplied in a 1152-BBGA package, rated for industrial temperature operation, and operates from a low-voltage core supply.

Key Features

• Logic Capacity  622,000 logic elements, providing high-density programmable logic resources for complex designs.
• Embedded Memory  Approximately 51.2 Mbits of embedded on-chip RAM to support large buffering, LUT-based memory, and data storage requirements.
• I/O Density  552 user I/O pins to support wide parallel interfaces and extensive board-level connectivity.
• Package  1152-BBGA (FCBGA) package; supplier device package listed as 1152-FBGA (35×35) suitable for surface-mount assembly.
• Power and Core Supply  Core voltage supply range specified between 820 mV and 880 mV for the device.
• Operating Temperature  Industrial temperature grade with specified operating range from –40 °C to 100 °C.
• Compliance  RoHS compliant.

Typical Applications

• High-density programmable logic designs  Large logic element count and substantial embedded memory make this device suitable for complex FPGA implementations where on-chip resources are critical.
• Multi-interface systems  High I/O count supports designs that require numerous parallel and serial interfaces across a single FPGA.
• Industrial solutions  Industrial temperature rating (–40 °C to 100 °C) supports deployment in temperature-challenging environments where extended operating range is required.

Unique Advantages

• High programmable density: 622,000 logic elements provide the scale needed for large-scale integration and consolidation of multiple functions into a single device.
• Substantial on-chip memory: Approximately 51.2 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage tasks.
• Extensive I/O capability: 552 I/O pins enable broad connectivity and simplify board-level routing for multi-channel systems.
• Industrial-grade thermal tolerance: Rated from –40 °C to 100 °C to support applications with wide ambient temperature requirements.
• Low-voltage core operation: Core supply specified at 820–880 mV, aligning with low-voltage FPGA deployment strategies.
• RoHS compliant and surface-mount package: 1152-BBGA (FCBGA) surface-mount package supports modern PCB assembly flows and regulatory compliance.

Why Choose 5SGXMA7H3F35I3G?

The 5SGXMA7H3F35I3G delivers a combination of high logic density, ample embedded memory, and extensive I/O in a single industrial-temperature FPGA package. Its low-voltage core requirement and surface-mount 1152-BBGA footprint make it suitable for designers looking to consolidate functionality while meeting thermal and assembly constraints.

As a member of the Intel Stratix V GX family, the device is documented within the Stratix V device datasheet series, which provides detailed electrical, switching, and I/O timing characteristics to support integration and long-term design planning.

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