5SGXMA7H3F35I3LN

IC FPGA 552 I/O 1152FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 552 51200000 622000 1152-BBGA, FCBGA

Quantity 723 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O552Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs234720Number of Logic Elements/Cells622000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits51200000

Overview of 5SGXMA7H3F35I3LN – Stratix® V GX Field Programmable Gate Array (FPGA) IC 552 51200000 622000 1152-BBGA, FCBGA

The 5SGXMA7H3F35I3LN is a Stratix® V GX field programmable gate array (FPGA) optimized for designs that require large programmable logic capacity, substantial embedded memory, and extensive I/O. This device provides a high-density programmable fabric with transceiver-capable architecture and is offered in an industrial temperature grade to support demanding operational environments.

With hundreds of thousands of logic blocks, tens of megabits of on-chip RAM, and a high I/O count in a 1152-ball FCBGA package, the 5SGXMA7H3F35I3LN is suited to integration into systems that need significant logic integration, high-speed connectivity, and industrial temperature operation.

Key Features

  • Logic Capacity  Approximately 622,000 logic elements and 234,720 logic blocks provide a large programmable fabric for complex custom logic and system-level integration.
  • Embedded Memory  Approximately 51.2 Mbits of on-chip RAM to support buffering, LUT-based storage, and data-path implementations.
  • I/O Density  552 user I/O pins enable broad external interfacing and parallel connectivity for multi-channel systems.
  • Package  1152-BBGA (FCBGA) supplier package, 1152-FBGA (35×35) format, providing a high-pin-count, compact footprint for dense system boards.
  • Power and Core Supply  Core supply voltage specified from 820 mV to 880 mV for the device core operating range.
  • Temperature and Grade  Industrial temperature grade with an operating range of −40 °C to 100 °C for deployment in demanding environments.
  • Mounting and Compliance  Surface-mount device with RoHS compliance for lead-free assembly and regulatory alignment.
  • Transceiver Capability (Series-level)  Stratix V GX-series devices include transceiver speed grade options (as described in the Stratix V device documentation) for high-speed serial links.

Typical Applications

  • Industrial Control and Automation  Industrial-grade temperature support and high logic density make this FPGA suitable for control systems and automation platforms that require robust operation.
  • High-speed Serial Interfaces  GX transceiver-capable architecture (per Stratix V GX device documentation) supports designs requiring high-speed serial connectivity.
  • System Integration and Offload  Large embedded memory and extensive logic resources enable offloading and integration of complex algorithms and peripheral control within a single device.
  • Data-path and Buffering  Substantial on-chip RAM is useful for packet buffering, data-stream staging, and intermediate storage in high-throughput applications.

Unique Advantages

  • High integration density: Large counts of logic elements and logic blocks reduce the need for multiple discrete components, simplifying board-level design.
  • Substantial on-chip memory: Approximately 51.2 Mbits of embedded RAM supports complex algorithms and high-bandwidth data handling without external memory dependency.
  • Extensive I/O capability: 552 I/O pins enable diverse peripheral connections and parallel interfaces for system-level flexibility.
  • Industrial-grade operation: −40 °C to 100 °C operating range aligns the device with applications that require broader temperature margins.
  • Compact high-pin-count package: 1152-ball FCBGA (35×35) package provides a dense footprint for space-constrained system designs.
  • Regulatory alignment: RoHS-compliant construction supports lead-free manufacturing processes.

Why Choose 5SGXMA7H3F35I3LN?

The 5SGXMA7H3F35I3LN offers a combination of large programmable logic capacity, significant embedded memory, and a high I/O count in a compact 1152-ball FCBGA package. Its industrial temperature rating and RoHS compliance make it appropriate for systems that demand both robustness and regulatory alignment.

This device is suited for engineers and system architects building integrated, high-density FPGA solutions needing ample on-chip resources and transceiver-capable architecture at the Stratix V GX family level.

Request a quote or submit an inquiry to discuss availability, pricing, and how the 5SGXMA7H3F35I3LN can meet your project requirements.

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