5SGXMA7H3F35I4G

The 5SGXMA7H3F35I4G is a Stratix V GX Field Programmable Gate Array (FPGA) IC from Intel, offered in an industrial temperature grade. It delivers high on-chip logic and I/O capacity with integrated embedded memory and is packaged in a high-density 1152-ball FCBGA.

Key attributes include 622,000 logic elements, approximately 51 Mbits of embedded memory, and 552 user I/Os, making the device suitable for designs that require substantial logic resources and wide I/O connectivity within an industrial operating range.

Key Features

• Core / Logic  622,000 logic elements for large-scale programmable logic and complex system implementation.
• Embedded Memory  Approximately 51 Mbits of on-chip RAM to support buffering, LUTs, and data-intensive processing without external memory for many functions.
• I/O Capacity  552 user I/O pins to enable broad peripheral connectivity and multi-channel interfacing on a single device.
• Package & Mounting  1152-BBGA (FCBGA) supplier package 1152-FBGA (35×35), surface-mount package designed for compact, high-density board layouts.
• Power  Core voltage supply specified between 820 mV and 880 mV to match platform power requirements.
• Temperature & Grade  Industrial grade with an operating temperature range of −40 °C to 100 °C for deployments in demanding environments.

Typical Applications

• High-density digital systems  Leverage 622,000 logic elements and ~51 Mbits of embedded memory to implement complex digital processing, signal aggregation, or protocol handling on a single device.
• I/O-intensive platforms  Use the 552 I/Os for multi-channel interfacing, high-pin-count sensor arrays, or extensive peripheral connectivity without external multiplexing.
• Industrial control and automation  Industrial-grade operation and wide temperature range support deployment in factory, process, and industrial equipment requiring reliable logic and I/O resources.

Unique Advantages

• High logic integration: 622,000 logic elements reduce the need for multiple discrete FPGAs or companion logic, simplifying system design and BOM.
• Substantial embedded memory: Approximately 51 Mbits of on-chip RAM enables local buffering and state storage that can lower external memory dependence.
• Extensive I/O count: 552 user I/Os provide flexibility to connect numerous peripherals or parallel interfaces directly to the FPGA.
• Industrial temperature capability: Rated −40 °C to 100 °C to meet the thermal requirements of industrial deployments.
• Compact, high-density package: 1152-ball FCBGA (35×35) package supports dense PCB implementations while maintaining a surface-mount form factor.
• Low-voltage core operation: Specified 820–880 mV supply range supports low-voltage power architectures.

Why Choose 5SGXMA7H3F35I4G?

The 5SGXMA7H3F35I4G combines substantial programmable logic resources, generous embedded memory, and a high I/O count in an industrial-grade Stratix V GX FPGA. Its package and power specifications make it suitable for compact, high-density boards where performance and I/O flexibility are required across a wide temperature range.

This part is appropriate for engineering teams targeting large, integrated FPGA designs that benefit from consolidated logic, on-chip memory, and broad connectivity while operating in industrial environments supported by Intel's Stratix V GX device family documentation.

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