5SGXMA7K1F35C1G
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 432 51200000 622000 1152-BBGA, FCBGA |
|---|---|
| Quantity | 796 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 432 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 234720 | Number of Logic Elements/Cells | 622000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 51200000 |
Overview of 5SGXMA7K1F35C1G – Stratix® V GX Field Programmable Gate Array (FPGA) IC
The 5SGXMA7K1F35C1G is a Stratix® V GX family FPGA offering very high logic density and on-chip memory for complex digital designs. It delivers a large programmable fabric with extensive I/O and a compact 1152-BBGA surface-mount package to support dense system integration.
This commercial-grade device provides 622,000 logic elements and approximately 51.2 Mbits of embedded memory, 432 user I/Os, and a documented operating supply range and temperature window suitable for mainstream embedded and communications-focused designs.
Key Features
- Core Capacity — 622,000 logic elements to implement large-scale digital logic, state machines, and custom compute pipelines.
- Embedded Memory — Approximately 51.2 Mbits of on-chip RAM for buffering, frame storage, and system-level memory needs without external RAM.
- I/O Density — 432 user I/Os to support high-channel-count interfaces and parallel connectivity to peripherals and subsystems.
- Package & Mounting — 1152-BBGA (supplier package: 1152-FBGA, 35×35) in a surface-mount form factor for compact board layouts and high pin count routing.
- Power and Operating Range — Documented core supply range of 870 mV to 930 mV, enabling predictable power planning; commercial-grade operating temperature 0 °C to 85 °C.
- Regulatory Compliance — RoHS compliant to meet standard environmental and manufacturing requirements.
Typical Applications
- High-density digital processing — Implement complex logic, packet processing, or algorithm acceleration using the device’s 622,000 logic elements and abundant on-chip RAM.
- Multi-channel I/O systems — 432 I/Os enable aggregation and control of many parallel interfaces, sensors, or peripherals in a compact footprint.
- Embedded system prototyping — Large programmable fabric and memory allow rapid development and validation of system-level designs before production.
Unique Advantages
- High integration density: Large logic element count and substantial embedded memory reduce the need for external components, simplifying BOM and PCB design.
- Compact, high-pin-count package: The 1152-BBGA (35×35) package supports dense routing and minimizes board area for space-constrained designs.
- Predictable power envelope: Specified core voltage range (870 mV–930 mV) aids in accurate power budgeting and thermal planning.
- Extensive I/O capacity: 432 user I/Os provide flexibility to connect multiple interfaces and high-channel-count devices directly to the FPGA fabric.
- Commercial-grade availability: Rated for 0 °C to 85 °C operation to meet mainstream embedded application requirements.
- RoHS compliant: Supports standard manufacturing and environmental compliance practices.
Why Choose 5SGXMA7K1F35C1G?
The 5SGXMA7K1F35C1G positions itself as a high-capacity, highly integrated FPGA option within the Stratix V GX family, balancing a large programmable fabric, significant embedded memory, and broad I/O capability in a compact BGA package. It is suited to designers who require substantial on-chip resources for advanced digital logic, buffering, and multi-channel interfacing while maintaining a predictable power and thermal profile.
For projects requiring scalability in logic and memory, this device offers a strong platform for prototyping and deployment in commercial embedded systems where high integration and I/O count are primary considerations.
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