5SGXMA7K1F35C1G

IC FPGA 432 I/O 1152FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 432 51200000 622000 1152-BBGA, FCBGA

Quantity 796 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGA, FCBGANumber of I/O432Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs234720Number of Logic Elements/Cells622000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits51200000

Overview of 5SGXMA7K1F35C1G – Stratix® V GX Field Programmable Gate Array (FPGA) IC

The 5SGXMA7K1F35C1G is a Stratix® V GX family FPGA offering very high logic density and on-chip memory for complex digital designs. It delivers a large programmable fabric with extensive I/O and a compact 1152-BBGA surface-mount package to support dense system integration.

This commercial-grade device provides 622,000 logic elements and approximately 51.2 Mbits of embedded memory, 432 user I/Os, and a documented operating supply range and temperature window suitable for mainstream embedded and communications-focused designs.

Key Features

  • Core Capacity — 622,000 logic elements to implement large-scale digital logic, state machines, and custom compute pipelines.
  • Embedded Memory — Approximately 51.2 Mbits of on-chip RAM for buffering, frame storage, and system-level memory needs without external RAM.
  • I/O Density — 432 user I/Os to support high-channel-count interfaces and parallel connectivity to peripherals and subsystems.
  • Package & Mounting — 1152-BBGA (supplier package: 1152-FBGA, 35×35) in a surface-mount form factor for compact board layouts and high pin count routing.
  • Power and Operating Range — Documented core supply range of 870 mV to 930 mV, enabling predictable power planning; commercial-grade operating temperature 0 °C to 85 °C.
  • Regulatory Compliance — RoHS compliant to meet standard environmental and manufacturing requirements.

Typical Applications

  • High-density digital processing — Implement complex logic, packet processing, or algorithm acceleration using the device’s 622,000 logic elements and abundant on-chip RAM.
  • Multi-channel I/O systems — 432 I/Os enable aggregation and control of many parallel interfaces, sensors, or peripherals in a compact footprint.
  • Embedded system prototyping — Large programmable fabric and memory allow rapid development and validation of system-level designs before production.

Unique Advantages

  • High integration density: Large logic element count and substantial embedded memory reduce the need for external components, simplifying BOM and PCB design.
  • Compact, high-pin-count package: The 1152-BBGA (35×35) package supports dense routing and minimizes board area for space-constrained designs.
  • Predictable power envelope: Specified core voltage range (870 mV–930 mV) aids in accurate power budgeting and thermal planning.
  • Extensive I/O capacity: 432 user I/Os provide flexibility to connect multiple interfaces and high-channel-count devices directly to the FPGA fabric.
  • Commercial-grade availability: Rated for 0 °C to 85 °C operation to meet mainstream embedded application requirements.
  • RoHS compliant: Supports standard manufacturing and environmental compliance practices.

Why Choose 5SGXMA7K1F35C1G?

The 5SGXMA7K1F35C1G positions itself as a high-capacity, highly integrated FPGA option within the Stratix V GX family, balancing a large programmable fabric, significant embedded memory, and broad I/O capability in a compact BGA package. It is suited to designers who require substantial on-chip resources for advanced digital logic, buffering, and multi-channel interfacing while maintaining a predictable power and thermal profile.

For projects requiring scalability in logic and memory, this device offers a strong platform for prototyping and deployment in commercial embedded systems where high integration and I/O count are primary considerations.

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