5SGXMA7K1F35C2G

The 5SGXMA7K1F35C2G is a Stratix V GX FPGA from Intel, offered in a commercial temperature grade. It provides a high-density programmable fabric paired with substantial on-chip memory and a large I/O count for complex digital designs.

Key Features

• High Logic Density  Provides 622,000 logic elements suitable for integrating large, complex logic functions on a single device.
• Embedded Memory  Approximately 51.2 Mbits of on-chip RAM available for buffering, state storage, and memory-mapped functions.
• Rich I/O  432 user I/Os to support wide parallel interfaces and diverse peripheral connectivity requirements.
• Low-Voltage Core  Core voltage supply range of 870 mV to 930 mV, reflecting the device’s low-voltage operating domain.
• Commercial Temperature Grade  Rated for operation from 0 °C to 85 °C for standard commercial-environment deployments.
• Package & Mounting  1152-BBGA (FCBGA) package, supplier device package listed as 1152-FBGA (35×35), designed for surface-mount assembly.
• Standards Compliance  RoHS-compliant construction to meet common regulatory and manufacturing requirements.

Unique Advantages

• High integration potential: 622,000 logic elements and large on-chip RAM reduce the need for external logic and memory, simplifying board-level design.
• Broad I/O support: 432 I/Os enable wide data buses and multiple parallel interfaces without additional bridging devices.
• Compact system footprint: The 1152-BBGA (35×35) FCBGA package supports high-density PCB layouts while maintaining surface-mount convenience.
• Commercial-ready thermal range: Rated 0 °C to 85 °C for deployment in standard commercial applications where that temperature range is required.
• Regulatory-ready: RoHS compliance simplifies incorporation into lead-free manufacturing flows.

Why Choose 5SGXMA7K1F35C2G?

The 5SGXMA7K1F35C2G positions itself as a high-capacity Stratix V GX FPGA option for designs that require substantial logic density, significant embedded memory, and a large complement of I/Os in a compact surface-mount package. Its low-voltage core operation and commercial temperature rating make it suitable for demanding digital applications within commercial environments.

Engineers selecting this device can leverage the documented Stratix V family specifications to align device selection with system-level requirements while benefiting from RoHS-compliant packaging and high integration potential to reduce BOM complexity.

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