5SGXMA7K1F35C2LG

The 5SGXMA7K1F35C2LG is a Stratix V GX FPGA manufactured by Intel. It delivers large programmable logic capacity with 622,000 logic elements and approximately 51.2 Mbits of embedded memory for on-chip storage and buffering.

Packaged in a 1152-ball FCBGA/FBGA surface-mount package and rated for commercial operation, this device is suited to designs that require high logic density, significant on-chip RAM, and extensive I/O connectivity.

Key Features

• High Logic Density  Provides 622,000 logic elements to support complex programmable logic implementations.
• Embedded Memory  Approximately 51.2 Mbits of total RAM bits for on-chip data storage, FIFOs, and buffering.
• Extensive I/O  432 user I/O pins to accommodate broad external connectivity requirements.
• Core Supply Voltage  Core voltage supply range of 820 mV to 880 mV for device power planning.
• Package & Mounting  Surface-mount FCBGA package; supplier device package listed as 1152-FBGA (35×35) with package case 1152-BBGA, FCBGA.
• Commercial Temperature Grade  Rated for operation from 0 °C to 85 °C and specified as Commercial grade.
• Regulatory Compliance  RoHS status: Compliant.

Unique Advantages

• Substantial programmable logic: 622,000 logic elements provide the capacity to implement large, multi-module FPGA designs without immediate migration.
• Significant on-chip RAM: Approximately 51.2 Mbits of embedded memory reduces dependence on external memory for many buffering and storage needs.
• High I/O availability: 432 I/Os enable flexible interfacing to peripherals, memory, and high-pin-count system requirements.
• Compact surface-mount package: 1152-ball FCBGA/FBGA footprint balances high device density with standard surface-mount assembly.
• Defined commercial operating range: 0 °C to 85 °C rating simplifies thermal and system-level planning for commercial products.
• Standards-aware manufacturing: RoHS compliance supports environmental and regulatory requirements for many markets.

Why Choose 5SGXMA7K1F35C2LG?

The 5SGXMA7K1F35C2LG positions itself as a high-density Stratix V GX FPGA option from Intel, combining a large logic element count and substantial embedded RAM with a high I/O count and a compact 1152-ball FCBGA/FBGA package. Its commercial temperature rating and RoHS compliance make it suitable for a wide range of commercial electronic designs that need on-chip capacity and connectivity.

Engineers and procurement teams looking for a device with extensive programmable resources and clearly defined electrical and packaging characteristics can rely on the specifications provided for system integration, power budgeting, and board-level design.

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