5SGXMA7K1F35C1WN

The 5SGXMA7K1F35C1WN is a Stratix V GX Field Programmable Gate Array (FPGA) IC from Intel offering high-density programmable logic with on-chip embedded memory and extensive I/O. This surface-mount FCBGA device combines 622,000 logic elements with approximately 51.2 Mbits of embedded RAM and 432 user I/Os in a 1152‑BBGA (35×35) package.

Designed for commercial temperature environments, the device operates from 0 °C to 85 °C and requires a core voltage supply between 870 mV and 930 mV. It is RoHS compliant and intended for designs that demand high logic capacity, significant embedded memory, and a large I/O count in a compact ball-grid package.

Key Features

• High logic capacity — 622,000 logic elements provide substantial programmable fabric for complex digital designs and large-scale logic integration.
• Embedded memory — Approximately 51.2 Mbits of on-chip RAM to support large buffering, lookup tables, and state storage without external memory.
• Extensive I/O — 432 I/O pins to enable dense board-level interfacing and multiple peripheral connections.
• FCBGA package — 1152‑BBGA (1152‑FBGA, 35×35) supplier device package in a surface-mount form factor for compact, high-pin-count board designs.
• Power supply — Core voltage range from 870 mV to 930 mV for defined operating conditions and power planning.
• Commercial temperature grade — Rated for operation from 0 °C to 85 °C for standard commercial applications.
• Regulatory compliance — RoHS compliant to support environmentally conscious designs.

Typical Applications

• High-density digital systems — Use where hundreds of thousands of logic elements and multi-megabit embedded RAM are required for complex logic and control functions.
• High I/O interface boards — Ideal for applications needing extensive parallel or multiplexed I/O thanks to 432 available pins.
• Compact, high-pin-count integration — The 1152‑BBGA FCBGA package supports tight board layouts and high connection density in surface-mount assemblies.

Unique Advantages

• Substantial programmable capacity: 622,000 logic elements allow designers to consolidate functions and reduce external ASIC or ASSP count.
• Large on-chip memory: Approximately 51.2 Mbits of embedded RAM minimizes dependence on external memory for buffering and state storage.
• High I/O count: 432 I/Os enable flexible interfacing to peripherals, sensors, and parallel data paths without additional expansion devices.
• Compact, manufacturable package: 1152‑BBGA surface-mount package supports high-density PCB routing while maintaining robust assembly processes.
• Commercial operating range: Specified 0 °C to 85 °C operation and defined core voltage (870–930 mV) simplify system-level power and thermal design for commercial products.
• RoHS compliance: Environmentally compliant construction supports regulatory requirements for many markets.

Why Choose 5SGXMA7K1F35C1WN?

The 5SGXMA7K1F35C1WN delivers a balanced combination of high logic density, substantial embedded memory, and a large I/O complement in a compact FCBGA package—well suited for commercial-grade systems that require significant programmable resources and board-level connectivity. Its defined core voltage window and operating temperature range make it straightforward to integrate into power- and thermally-managed designs.

This device is a fit for engineers and teams developing complex digital systems, high-density interface platforms, or FPGA-based consolidation projects that benefit from large on-chip resources and a high-pin-count package backed by Intel's Stratix V family specifications.

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