5SGXMA7H3F35I4N

The 5SGXMA7H3F35I4N is a Stratix® V GX field programmable gate array (FPGA) IC offered in an industrial temperature grade. It delivers a high logic density FPGA fabric with substantial on‑chip memory and a large I/O count suitable for complex digital systems.

This device targets applications that require high logic capacity, abundant embedded RAM, and broad I/O connectivity while operating across an extended industrial temperature range. Core supply requirements are specified between 820 mV and 880 mV.

Key Features

• Logic Capacity  Provides 622,000 logic elements suitable for large, complex designs and high-density logic implementations.
• Embedded Memory  Approximately 51.2 Mbits of on‑chip RAM for buffering, packet storage, and algorithmic state memory.
• I/O Resources  552 user I/O pins to support wide external connectivity and multi‑lane interfaces.
• Package & Mounting  Supplied in a 1152‑BBGA (FCBGA) package; supplier package listed as 1152‑FBGA (35×35) with surface‑mount mounting.
• Power  Core voltage supply specified between 820 mV and 880 mV for device operation.
• Temperature Range  Industrial operating range from −40 °C to 100 °C for deployment in demanding environments.
• Compliance  RoHS compliant.
• Stratix V GX Series Details (series datasheet)  Series documentation covers electrical and switching characteristics including operating conditions, power, I/O timing, and transceiver speed grade information for Stratix V GX devices.

Typical Applications

• High‑density signal processing  Leverages 622,000 logic elements and approximately 51.2 Mbits of embedded RAM to implement complex DSP pipelines and packet processing engines.
• Communications and networking  Large I/O count and Stratix V GX series transceiver capabilities (as documented in the series datasheet) support multi‑lane links and protocol bridging.
• Test, measurement and instrumentation  Industrial temperature rating and substantial on‑chip resources enable reliable operation in lab and field instrumentation.
• Prototyping and advanced FPGA systems  High logic density and extensive I/O make this device suitable for system‑level prototyping and integration into complex FPGA‑based platforms.

Unique Advantages

• High logic density: 622,000 logic elements reduce the need for multiple devices when implementing large designs.
• Significant embedded RAM: Approximately 51.2 Mbits of on‑chip memory enables large buffers and state storage without external memory for many applications.
• Extensive I/O: 552 I/O pins provide flexibility to interface with numerous peripherals, data converters, and multi‑lane links.
• Industrial temperature capability: Rated from −40 °C to 100 °C for deployment in environments requiring extended temperature tolerance.
• Compact BGA package: 1152‑BBGA (1152‑FBGA, 35×35) surface‑mount package balances high pin count with a compact footprint for board integration.
• Documented electrical characteristics: Series datasheet provides detailed guidance on operating conditions, switching characteristics, and transceiver speed grade information to support system design.

Why Choose 5SGXMA7H3F35I4N?

The 5SGXMA7H3F35I4N offers a compelling combination of logic capacity, embedded memory, and I/O density in an industrial‑rated Stratix V GX FPGA package. It is well suited for engineers building complex digital systems that require substantial on‑chip resources and a broad set of I/O in a compact, surface‑mount BGA form factor.

Designs that demand scalable logic, sizable internal RAM, and reliable operation across extended temperatures can leverage the documented electrical and switching characteristics of the Stratix V GX series to plan power, timing, and I/O integration with confidence.

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