5SGXMA7H3F35I3N

The 5SGXMA7H3F35I3N is a Stratix® V GX Field Programmable Gate Array (FPGA) IC from Intel, offered in a 1152-ball BGA (35×35) surface-mount package. It provides a high-density programmable logic platform with a large logic element count, substantial on-chip memory, and a high I/O count for complex digital designs.

Targeted for industrial-grade deployments, this device supports an extended operating temperature range and a low-voltage core supply, making it suitable for designs that require dense logic, significant embedded RAM, and broad I/O connectivity within a compact FCBGA footprint.

Key Features

• High Logic Capacity — Approximately 622,000 logic elements to implement large, complex digital designs and custom hardware functions.
• Embedded Memory — Approximately 51.2 Mbits of on-chip RAM for buffering, lookup tables, and memory-intensive logic without immediate dependence on external DRAM.
• I/O Density — 552 device I/Os to support extensive peripheral interfacing and multi-channel connectivity within a single FPGA.
• Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C, enabling use in industrial and temperature-challenging environments.
• Low-Voltage Core — Core supply range of 820 mV to 880 mV for compatibility with low-voltage power architectures.
• Package and Mounting — 1152-BBGA (FCBGA) 35×35 supplier device package in a surface-mount form factor for high-density board integration.
• RoHS Compliant — Environmentally compliant with RoHS requirements.

Typical Applications

• High-density programmable logic systems — Use the large logic element count and embedded RAM to consolidate complex logic and offload computation from CPUs or discrete ASICs.
• Multi-channel I/O and interface hubs — Leverage 552 I/Os for aggregating multiple digital interfaces or for dense sensor and peripheral connectivity.
• Memory-intensive hardware blocks — Employ the approximately 51.2 Mbits of on-chip RAM for buffering, packet processing, or table-based functions that benefit from fast local memory.
• Industrial embedded systems — The −40 °C to 100 °C operating range and RoHS compliance make the device suitable for industrial control and automation equipment requiring long-term reliability.

Unique Advantages

• Large programmable fabric: Approximately 622,000 logic elements reduce the need to partition across multiple devices, simplifying system architecture.
• Substantial on-chip memory: Approximately 51.2 Mbits of embedded RAM lowers external memory dependencies and improves data-path latency.
• High I/O count: 552 I/Os enable complex front-end and back-end interfacing without immediate expansion hardware.
• Industrial-ready thermal range: Rated from −40 °C to 100 °C for deployment in temperature-challenging environments.
• Compact, high-density package: 1152-BBGA (35×35) FCBGA balances board-level density with robust pinout capability for complex systems.
• Low-voltage core operation: 0.82–0.88 V core supply supports modern low-power power-rail architectures.

Why Choose 5SGXMA7H3F35I3N?

The 5SGXMA7H3F35I3N combines a high logic element count, substantial embedded RAM, and a large I/O complement in a compact 1152-BBGA package, positioning it for demanding programmable logic tasks where integration density and on-chip resources matter. Its industrial temperature rating and low-voltage core make it suitable for robust embedded applications that require stability across a wide thermal range.

This Stratix® V GX device is appropriate for engineering teams designing complex FPGA-based systems that prioritize consolidated logic, local memory capacity, and broad interfacing capability while maintaining a compact board footprint. The device is supported by the Stratix V device documentation for electrical and switching characteristics to guide system integration and thermal/power planning.

Request a quote or submit an inquiry to receive pricing and availability information for the 5SGXMA7H3F35I3N and to discuss how it fits your next high-density programmable design.