5SGXMA7H3F35I3LG

The 5SGXMA7H3F35I3LG is an Intel Stratix® V GX field programmable gate array (FPGA) offered in an industrial temperature grade. It provides a high-density programmable fabric with large on-chip memory and a substantial I/O complement, delivered in a 1152-ball FCBGA package for surface-mount applications. This device targets complex, high-performance designs that require extensive logic resources, embedded memory, and broad external connectivity.

Key Features

• Core logic density – 622,000 logic element cells to implement complex custom logic, state machines, and dataplane functions.
• Embedded memory – Approximately 51.2 Mbits of on-chip RAM to support buffering, packet processing, and large lookup tables without external memory.
• I/O capability – 552 user I/O pins to interface with high-channel-count peripherals, multi-lane interfaces, and extensive board-level routing.
• Power and voltage – Core voltage specified from 820 mV to 880 mV for the device core power domain.
• Package and mounting – 1152-BBGA (supplier package: 1152-FBGA, 35×35) in a surface-mount form factor suitable for compact, high-density PCBs.
• Temperature and grade – Industrial grade with an operating temperature range of −40 °C to 100 °C for deployment in demanding environments.
• Regulatory compliance – RoHS-compliant to meet lead-free and restricted substance requirements.

Typical Applications

• High-performance networking – Large logic capacity and plentiful I/O make this device suited for packet processing, line-rate switching, and protocol offload functions.
• Data center acceleration – Substantial on-chip RAM and dense logic enable custom acceleration engines and inline data manipulation tasks.
• Industrial automation and control – Industrial temperature rating and extensive I/O support complex control systems, motion control, and deterministic I/O handling.
• Signal and video processing – High logic density and embedded memory allow implementation of multi-channel DSP pipelines, video frame buffering, and real-time processing algorithms.
• Test and measurement – Large logic resources combined with a broad I/O set enable custom instrumentation, high-channel-count acquisition, and real-time analysis.

Unique Advantages

• High-density programmable fabric: 622,000 logic element cells provide the capacity to consolidate multiple functions into a single device, reducing system BOM and board complexity.
• Significant on-chip memory: Approximately 51.2 Mbits of embedded RAM reduces dependence on external memory, improving latency and simplifying board design.
• Extensive I/O headroom: 552 I/O pins support multi-lane interfaces and numerous peripheral connections for versatile system integration.
• Industrial temperature range: −40 °C to 100 °C operation allows deployment in harsher environments without additional thermal qualification.
• Compact, manufacturable package: 1152-ball FCBGA surface-mount package enables space-efficient, production-friendly assembly on high-density PCBs.
• RoHS compliance: Conforms to lead-free and restricted substance standards for broad market acceptance.

Why Choose 5SGXMA7H3F35I3LG?

The 5SGXMA7H3F35I3LG combines large logic capacity, substantial embedded memory, and a high I/O count in an industrial-grade Stratix V GX FPGA package. It is well-suited for engineers building complex, performance-sensitive systems that require on-chip resources to minimize external components and improve system responsiveness.

Designed for applications where integration density, thermal robustness, and broad connectivity matter, this Intel Stratix V GX device delivers platform scalability and long-term support through the Stratix V family documentation and ecosystem.

Request a quote or submit an inquiry for the 5SGXMA7H3F35I3LG to evaluate fit and availability for your design requirements.