5SGXMA7H3F35I3WN

The 5SGXMA7H3F35I3WN is a Stratix V GX field programmable gate array from Intel, delivered in a 1152-ball FCBGA package. It provides a high-density programmable logic platform with a large embedded memory footprint and broad I/O support for demanding designs.

Designed for industrial-grade applications, this device combines 622,000 logic elements with approximately 51.2 Mbits of on-chip RAM and 552 user I/O pins, making it suitable for systems that require high logic capacity, significant embedded memory, and extensive interfacing in a surface-mount BGA package.

Key Features

• Core Logic Density — 622,000 logic elements (cells) to implement complex, high-density programmable logic and custom hardware functions.
• Embedded Memory — Approximately 51.2 Mbits of total RAM bits for on-chip buffering, lookup tables, and state storage.
• I/O Capability — 552 user I/O pins to support wide parallel interfaces and multiple high-speed serial/parallel connections.
• Transceiver Performance (Series-Level) — Stratix V GX series documentation includes transceiver speed grades up to 14.1 Gbps, indicating the family’s support for high-speed serial links (series-level specification).
• Package and Mounting — 1152-BBGA FCBGA package (1152-FBGA, 35×35) with surface-mount construction for compact PCB integration.
• Voltage and Power — Core voltage supply range of 820 mV to 880 mV for the device core.
• Industrial Temperature Grade — Rated operating temperature from −40 °C to 100 °C for industrial applications.
• RoHS Compliant — Device meets RoHS environmental requirements.

Typical Applications

• High-density data processing — Deploy complex custom datapaths and parallel processing functions using 622,000 logic elements and large embedded memory.
• High-speed serial communications — Implement multi-gigabit serial links supported by Stratix V GX series transceiver grades for backplane, network, or link aggregation designs.
• Industrial control and instrumentation — Use in industrial systems that require extended operating temperature support (−40 °C to 100 °C) and robust I/O counts for sensors and actuators.
• Interface bridging and protocol conversion — 552 I/O pins enable wide parallel interfaces and numerous serial interfaces for protocol translation and system integration tasks.

Unique Advantages

• High programmable logic capacity: 622,000 logic elements enable large, complex FPGA designs without immediate need for external logic.
• Substantial on-chip memory: Approximately 51.2 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage tasks.
• Extensive connectivity: 552 I/O pins provide flexibility to connect multiple peripherals, interfaces, and board-level signals directly to the FPGA.
• Industrial temperature operation: Rated −40 °C to 100 °C to meet environmental requirements for industrial deployments.
• Compact BGA package: 1152-ball FCBGA (35×35) offers high pin density in a surface-mount form factor for space-constrained PCBs.
• Low-voltage core operation: Core supply range (820 mV–880 mV) compatible with modern low-voltage FPGA power architectures.

Why Choose 5SGXMA7H3F35I3WN?

This Stratix V GX FPGA is positioned for engineers who need a high-density, memory-rich programmable device with a large I/O complement and industrial operating range. Its combination of 622,000 logic elements, approximately 51.2 Mbits of on-chip RAM, and 552 I/Os supports complex signal processing, interfacing, and control functions within a single FPGA package.

Built on the Stratix V GX family technology and supplied in a compact 1152-BBGA FCBGA package, the 5SGXMA7H3F35I3WN delivers the integration and thermal robustness required for demanding embedded and industrial applications while remaining RoHS compliant.

Request a quote or submit a request for pricing and availability to evaluate the 5SGXMA7H3F35I3WN for your next high-density FPGA design.