5SGXMA7H3F35I4WN

The 5SGXMA7H3F35I4WN is a Stratix V GX field-programmable gate array (FPGA) in an FCBGA package designed for high-density programmable logic applications. This device combines a large logic fabric with substantial embedded memory and a high I/O count to support complex, I/O-intensive designs.

As a member of the Stratix V family, the device is supported by documented electrical and switching characteristics, including transceiver and I/O timing information in the device datasheet. The part is specified for industrial temperature operation, making it suitable for demanding environments.

Key Features

• Core / Logic Density 622,000 logic elements for high-density logic implementation and complex algorithm mapping.
• Embedded Memory Approximately 51.2 Mbits of on-chip RAM to support large buffering, state storage, and memory-intensive datapaths.
• I/O Resources 552 user I/O pins, enabling wide parallel interfaces and high pin-count system integration.
• Package and Mounting 1152-FBGA (35×35) supplier device package; Package case listed as 1152-BBGA, FCBGA. Surface-mount mounting type.
• Voltage Supply Core supply range specified from 820 mV to 880 mV.
• Temperature Grade Industrial grade with an operating temperature range of −40 °C to 100 °C.
• Environmental Compliance RoHS compliant.
• Documentation Part of the Stratix V family with detailed electrical and switching characteristics available in the device datasheet.

Typical Applications

• High-density digital processing — Implement complex algorithms and large logic networks using the device’s extensive logic resources and embedded RAM.
• High I/O interfacing — Use the 552 I/Os for wide data buses, protocol bridges, and systems requiring many external connections.
• Industrial control and automation — Industrial temperature rating and robust packaging support deployment in industrial environments.

Unique Advantages

• High logic integration: 622,000 logic elements provide the capacity for large-scale designs without partitioning across multiple devices.
• Substantial on-chip memory: Approximately 51.2 Mbits of embedded RAM reduces external memory dependence and simplifies board-level design.
• Extensive I/O availability: 552 I/Os enable flexible interfacing and parallel connectivity for system-level integration.
• Industrial temperature range: Specified operation from −40 °C to 100 °C for deployment in harsher environments.
• Compact FCBGA package: 1152-ball FCBGA (35×35) balances high integration density with surface-mount assembly.
• Standards-compliant environmental profile: RoHS compliance supports regulatory requirements for many system designs.

Why Choose 5SGXMA7H3F35I4WN?

The 5SGXMA7H3F35I4WN delivers a combination of large logic capacity, significant embedded memory, and a high I/O count in an industrial-grade Stratix V GX FPGA. It is suited to engineers developing complex, memory-heavy, and I/O-intensive systems who need a single-device solution with documented electrical and switching characteristics.

Choosing this Stratix V GX part supports scalable design development within the Stratix V family and leverages comprehensive device documentation for electrical, transceiver, and I/O timing characteristics.

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