5SGXMA7H3F35C4N

The 5SGXMA7H3F35C4N is a Stratix V GX Field Programmable Gate Array (FPGA) from Intel. Designed as a high-density, programmable logic device, this commercial-grade FPGA offers a large logic fabric, substantial on-chip RAM, and extensive I/O count for complex digital designs.

With 622,000 logic elements, approximately 51.2 Mbits of embedded memory, and 552 I/O pins in a 1152-BBGA FCBGA package, the device is positioned for designs that require significant integration of logic, memory, and I/O within a surface-mount, RoHS-compliant package.

Key Features

• Core Logic Density  622,000 logic elements provide a high-capacity programmable fabric for large or partitioned logic designs.
• Embedded Memory  Approximately 51.2 Mbits of on-chip RAM to support data buffering, state storage, and memory-intensive functions without external memory dependence.
• High Pin Count I/O  552 user I/Os enable broad external connectivity and support for multiple interfaces and parallel data paths.
• Package & Mounting  1152-BBGA (FCBGA) supplier package (1152-FBGA, 35×35) optimized for surface-mount assembly and high-density board integration.
• Power Supply  Specified core voltage range of 820 mV to 880 mV for the device core supply.
• Commercial Temperature Grade  Rated for 0°C to 85°C operation for commercial applications.
• Environmental Compliance  RoHS compliant.

Typical Applications

• High-density programmable systems  Use the large logic element count to implement complex state machines, datapaths, and custom hardware accelerators within a single FPGA.
• Memory-intensive processing  Leverage approximately 51.2 Mbits of embedded RAM for buffering, packet staging, and intermediate data storage in real-time processing tasks.
• Multi-interface platform designs  Deploy the 552 I/Os to consolidate multiple parallel and serial interfaces on one device, simplifying board-level integration.
• Compact, surface-mount assemblies  The 1152-BBGA FCBGA package supports high-density PCB layout and surface-mount manufacturing for space-constrained designs.

Unique Advantages

• High integration density: 622,000 logic elements reduce the need for multiple devices and simplify system architecture.
• Substantial on-chip memory: Approximately 51.2 Mbits of RAM lowers external memory requirements and shortens data paths for better latency control.
• Extensive I/O capability: 552 I/Os enable flexible connectivity and support for complex peripheral and interface mixes.
• Surface-mount FCBGA package: 1152-BBGA (1152-FBGA, 35×35) provides a compact, manufacturable footprint for high-density systems.
• Controlled core voltage: Narrow supply range (820 mV–880 mV) supports predictable power budgeting and system-level power design.
• Commercial temperature rating: Rated 0°C to 85°C for standard commercial deployments.

Why Choose 5SGXMA7H3F35C4N?

The 5SGXMA7H3F35C4N combines a high logic-element count, abundant embedded memory, and a large I/O complement in a compact FCBGA package, making it suitable for designs that demand significant on-chip resources and dense board-level integration. Its commercial temperature rating and RoHS compliance align with standard production and environmental requirements.

This device is appropriate for development teams and system designers seeking a single, high-capacity FPGA to consolidate logic, memory, and I/O functions—reducing component count and simplifying system architecture while maintaining predictable power and thermal parameters.

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