5SGXMA7H3F35C3WN

The 5SGXMA7H3F35C3WN is a Stratix® V GX family FPGA from Intel, offered in a 1152‑BBGA FCBGA package. It delivers high on‑chip logic and memory resources in a commercial‑grade device, intended for complex digital designs that require substantial logic density and embedded RAM.

Key attributes include 622,000 logic elements, approximately 51.2 Mbits of embedded memory, and 552 dedicated I/O pins, combined with a surface‑mount 1152‑FBGA (35×35) package and a commercial operating range of 0 °C to 85 °C.

Key Features

• Core Capacity  Approximately 622,000 logic elements and 234,720 logic array blocks (LABs) for large, compute‑intensive FPGA designs.
• Embedded Memory  Approximately 51.2 Mbits of on‑chip RAM to support high‑bandwidth buffering, state storage, and local data processing.
• I/O Density  552 I/O pins to accommodate complex interfaces and multi‑lane connectivity within a single device.
• Power  Specified voltage supply range of 820 mV to 880 mV to match platform core voltage requirements.
• Package & Mounting  1152‑BBGA, FCBGA package (supplier package: 1152‑FBGA, 35×35) designed for surface‑mount PCB assembly.
• Temperature & Grade  Commercial grade device with an operating temperature range of 0 °C to 85 °C.
• Compliance  RoHS compliant.

Typical Applications

• Large‑scale FPGA designs  For systems that require high logic density and significant embedded RAM within a single FPGA footprint.
• Complex I/O systems  Applications that need hundreds of I/O signals and flexible pin budgeting on a compact package.
• Data buffering and on‑chip processing  Designs that leverage substantial embedded memory for intermediate storage and local data handling.

Unique Advantages

• High logic density: 622,000 logic elements enable implementation of large designs without splitting functionality across multiple devices.
• Significant embedded memory: Approximately 51.2 Mbits of on‑chip RAM supports complex buffering and state machines directly on the FPGA.
• Robust I/O count: 552 I/O pins provide flexibility for multi‑interface designs and high‑pin‑count systems.
• Industry standard packaging: 1152‑FBGA (35×35) package in a surface‑mount form factor suitable for typical production assembly flows.
• Commercial temperature rating: Specified 0 °C to 85 °C operating range for mainstream commercial applications.
• Regulatory compliance: RoHS compliant for regulatory and manufacturing consistency.

Why Choose 5SGXMA7H3F35C3WN?

The 5SGXMA7H3F35C3WN positions itself as a high‑capacity Stratix V GX FPGA for commercial applications that demand large logic arrays, abundant embedded memory, and extensive I/O. Its combination of 622,000 logic elements, roughly 51.2 Mbits of on‑chip RAM, and 552 I/Os in a 1152‑FBGA package supports dense, single‑chip implementations of complex digital systems.

Designed and documented within the Intel Stratix V family, this device is suited to engineers and procurement teams specifying commercial‑grade FPGAs where logic capacity, memory resources, and I/O count are primary selection criteria.

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