5SGXMA7H3F35C3G

The Intel Stratix V GX 5SGXMA7H3F35C3G is a high-density field-programmable gate array (FPGA) in a 1152‑ball BGA FCBGA package. It provides a large programmable fabric with substantial on-chip memory and a high I/O count for complex digital designs.

This commercial‑grade device (0 °C to 85 °C) is supplied by Intel and is RoHS compliant. Electrical and switching characteristics for the Stratix V family are documented in the device datasheet, which details operating conditions and device-level performance parameters.

Key Features

• Core Logic Capacity  622,000 logic elements (logic element cells) for extensive programmable logic and high integration density.
• Embedded Memory  Approximately 51 Mbits of on‑chip RAM (51,200,000 total RAM bits) to support large data buffering and state storage without immediate reliance on external memory.
• I/O Density  552 user I/O pins to support multiple high‑pin-count interfaces and broad peripheral connectivity.
• Package & Mounting  1152‑BBGA, FCBGA package (supplier device package: 1152‑FBGA 35×35) designed for surface‑mount PCB assembly.
• Power Supply  Core voltage supply range of 0.820 V to 0.880 V for low‑voltage core operation.
• Temperature & Grade  Commercial grade device rated for 0 °C to 85 °C operating temperature.
• Compliance  RoHS compliant.

Unique Advantages

• High logic integration: The 622,000 logic elements allow consolidation of complex functions onto a single FPGA, reducing system-level component count.
• Significant on‑chip RAM: Approximately 51 Mbits of embedded memory enables large local buffering and state storage, helping to minimize external memory dependency.
• Extensive I/O resources: 552 I/Os provide the flexibility to interface with multiple parallel and serial subsystems without additional expanders.
• Compact, manufacturable package: The 1152‑BBGA (35×35) FCBGA package supports high pin density in a surface‑mount form factor suitable for dense PCB layouts.
• Low‑voltage core operation: Core supply between 0.82 V and 0.88 V aligns with modern low-power design domains.
• Commercial availability and compliance: Rated for 0 °C to 85 °C and RoHS compliant for standard commercial deployments.

Why Choose 5SGXMA7H3F35C3G?

The 5SGXMA7H3F35C3G combines a very large logic fabric, substantial embedded RAM, and a high‑density I/O complement in a compact 1152‑BBGA package, making it suitable for designs that require high integration and on‑chip resources. As a commercial‑grade Stratix V GX device from Intel, it is supported by detailed device datasheet documentation covering electrical and switching characteristics.

This device is well suited to design teams and procurement groups seeking a single FPGA solution that can accommodate large logic designs while offering significant on‑chip memory and a broad peripheral interface capability, all in a surface‑mount BGA package.

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