5SGXMA7H3F35C3N

The 5SGXMA7H3F35C3N is a Stratix® V GX Field Programmable Gate Array (FPGA) supplied in a 1152-BBGA FCBGA package. It provides large on-chip logic and memory resources along with a high I/O count for complex, I/O‑dense FPGA designs.

Device-level specifications include 622,000 logic elements, approximately 51.2 Mbits of embedded memory, 552 I/Os, and a commercial operating temperature range of 0 °C to 85 °C. The device is RoHS compliant and is supplied for surface-mount board assembly.

Key Features

• Logic Capacity 622,000 logic elements for large-scale logic implementation and complex programmable logic designs.
• Embedded Memory Approximately 51.2 Mbits of total on-chip RAM bits to support buffering, packet storage, and on-chip data processing.
• I/O Density 552 user I/O pins to support multi-channel interfaces and high pin-count system designs.
• Transceiver and Device Family Details Part of the Stratix V GX family; the Stratix V device datasheet documents transceiver speed grades and I/O timing characteristics applicable to GX devices.
• Power Supply Core supply range specified at 820 mV to 880 mV, enabling specified core operation within that voltage window.
• Package & Mounting 1152-BBGA (FCBGA) package; supplier device package listed as 1152-FBGA (35×35). Surface-mount mounting type.
• Operating Conditions & Grade Commercial grade device with operating temperature range 0 °C to 85 °C as specified.
• Compliance RoHS compliant.

Typical Applications

• High-density logic integration Use the device where hundreds of thousands of logic elements are required to implement complex state machines, data paths, or custom accelerators.
• Memory‑intensive on‑chip buffering Approximately 51.2 Mbits of embedded RAM supports packet buffering, FIFOs, and other on-chip storage needs.
• I/O‑rich system designs With 552 I/Os, the device fits applications requiring many parallel interfaces or mixed signal routing between subsystems.
• Transceiver-enabled architectures As a Stratix V GX device, consult the device datasheet for supported transceiver speed grades and use in designs requiring documented transceiver performance.

Unique Advantages

• Large programmable fabric 622,000 logic elements reduce the need for multi‑device partitioning in complex designs.
• Substantial on‑chip memory Approximately 51.2 Mbits of embedded memory enables significant on‑chip data handling without external RAM.
• High I/O count 552 I/Os simplify board-level connectivity for multi-channel and multi-interface systems.
• Controlled core voltage window Specified core supply range (820 mV–880 mV) supports predictable power design and core operation.
• Commercial temperature rating Designed for commercial-grade applications with an operating range of 0 °C–85 °C.
• Industry-standard package 1152-BBGA FCBGA (1152-FBGA 35×35) eases mechanical integration for surface-mount assembly.

Why Choose 5SGXMA7H3F35C3N?

The 5SGXMA7H3F35C3N combines extensive programmable logic, a large pool of embedded memory, and a high I/O count in a single commercial-grade Stratix V GX package. These measured device attributes make it suitable for designs that require substantial on-chip resources and dense external connectivity while operating within a defined commercial temperature and core voltage window.

This device is appropriate for engineers and system designers who need a single-FPGA solution to consolidate complex logic, on-chip buffering, and many I/Os, with the documentation-backed transceiver and electrical characteristics provided in the Stratix V datasheet.

Request a quote or submit an inquiry to receive pricing and availability information for 5SGXMA7H3F35C3N. Include your quantity and any required delivery timeframe to expedite processing.