5SGXMA7H3F35C2WN

The 5SGXMA7H3F35C2WN is a Stratix® V GX field programmable gate array (FPGA) IC from Intel, offered in a commercial temperature grade. It delivers high logic density and on-chip memory with extensive I/O in a 1152-BBGA FCBGA package, suitable for demanding commercial FPGA designs that require large programmable logic fabrics and significant embedded memory resources.

Key Features

• Logic Capacity  Provides 622,000 logic elements for implementing large-scale digital designs and complex custom logic.
• Embedded Memory  Includes approximately 51.2 Mbits of on-chip RAM to support buffering, LUT-based storage and data-path requirements.
• I/O Resources  Up to 552 user I/O pins, enabling broad external interfacing and high-pin-count system integration.
• Package  Supplied in a 1152-BBGA, FCBGA package (supplier device package: 1152-FBGA, 35×35 mm) for dense board-level routing and compact system footprints.
• Power and Core Voltage  Core supply range specified at 870 mV to 930 mV, reflecting the device’s low-voltage core operating window.
• Thermal and Mounting  Commercial operating temperature range of 0 °C to 85 °C and surface-mount package suitable for standard PCB assembly processes.
• Compliance  RoHS compliant for environmental and manufacturing compatibility.

Typical Applications

• High-density digital systems  Large FPGA logic capacity and on-chip RAM make the device suitable for complex digital processing and algorithmic acceleration in commercial systems.
• I/O-intensive designs  With 552 I/Os, the device supports applications that require extensive external interfacing and parallel connectivity.
• Platform prototyping and system integration  The combination of high logic count, embedded memory and compact 1152-BBGA packaging supports integration into prototype and production commercial boards.

Unique Advantages

• High logic density: 622,000 logic elements provide the headroom to implement large, multi-function FPGA designs without partitioning across multiple devices.
• Significant on-chip memory: Approximately 51.2 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage tasks.
• Extensive I/O capability: 552 user I/Os enable flexible connectivity to peripherals, transceivers, and system interfaces.
• Compact, manufacturable package: 1152-BBGA (35×35 mm) package balances pin count and board density for commercial product designs.
• Low-voltage core operation: 0.87–0.93 V supply supports modern low-voltage system architectures and power planning.
• RoHS compliant: Meets common regulatory requirements for environmental compliance in commercial products.

Why Choose 5SGXMA7H3F35C2WN?

The 5SGXMA7H3F35C2WN positions itself as a high-capacity commercial Stratix V GX FPGA for designers who need substantial programmable logic, ample embedded memory, and a large I/O footprint in a manufacturable BGA package. Its specified core voltage range and commercial temperature rating make it suitable for a wide range of commercial embedded systems where density and integration matter.

Backed by Intel documentation for the Stratix V family, this device is appropriate for teams prototyping and deploying complex FPGA-based solutions that require scalable resources, clear electrical specification, and RoHS-compliant components.

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