5SGXMA7H3F35C2LN

The 5SGXMA7H3F35C2LN is a commercial‑grade Stratix® V GX field programmable gate array (FPGA) supplied in a 1152‑BBGA FCBGA package. It provides a high logic capacity and extensive I/O, together with substantial on‑chip memory and transceiver‑oriented architecture characteristics described for the Stratix V family.

This device targets designs that require dense programmable logic, large embedded memory, and broad I/O connectivity within the Stratix V GX device family. Key value points include high logic density, approximately 51.2 Mbits of embedded RAM, and support for core voltages in the 820 mV to 880 mV range.

Key Features

• Logic Capacity — 622,000 logic elements (cells) to implement complex digital functions and large, parallel datapaths.
• Embedded Memory — Approximately 51.2 Mbits of on‑chip RAM to store large buffers, FIFOs, and state data without external memory.
• I/O Density — 552 dedicated I/O pins to interface with numerous peripherals, high‑speed links, and board‑level signals.
• Package — 1152‑BBGA (FCBGA) supplier package listed as 1152‑FBGA (35×35) for high pin‑count board integration.
• Power and Core Voltage — Rated core supply range of 820 mV to 880 mV to match system power rails and board power delivery design.
• Operating Temperature — Commercial operating range from 0 °C to 85 °C for typical commercial applications.
• Compliance — RoHS‑compliant material status for environmental and manufacturing considerations.

Typical Applications

• High‑density digital processing — Implement parallel processing engines, complex state machines, and large custom accelerators using the device's large logic capacity and embedded memory.
• Multi‑lane I/O systems — Leverage 552 I/Os for large peripheral interfaces, multi‑lane buses, and board‑level switching or aggregation tasks.
• Memory‑intensive buffering — Use approximately 51.2 Mbits of on‑chip RAM for packet buffering, FIFOs, and temporary storage to reduce external memory dependency.

Unique Advantages

• High logic density: 622,000 logic elements enable consolidation of multiple functions into a single device, reducing system component count.
• Substantial on‑chip memory: Approximately 51.2 Mbits of embedded RAM supports large internal datasets and buffering without immediate need for external DRAM.
• Extensive I/O connectivity: 552 I/O pins simplify interfacing to a wide range of peripherals and high‑pin‑count board designs.
• Commercial temperature grade: Rated for 0 °C to 85 °C operation to match standard commercial product requirements.
• RoHS compliant: Material compliance supports modern manufacturing and environmental requirements.

Why Choose 5SGXMA7H3F35C2LN?

The 5SGXMA7H3F35C2LN combines a large logic fabric, extensive embedded RAM, and a high I/O count in a 1152‑BBGA package, positioning it for demanding commercial FPGA designs that need high capacity and broad connectivity. As a member of the Stratix V GX family, it aligns with the device characteristics described for Stratix V devices while offering a commercial temperature grade and RoHS compliance.

This part is suitable for teams designing complex, logic‑heavy systems that benefit from on‑chip memory and plentiful I/O, and for projects where consolidation of functions into a single FPGA can reduce board complexity and BOM count.

Request a quote or submit an inquiry for 5SGXMA7H3F35C2LN to receive pricing and availability information for your design requirements.