5SGXMA7H3F35C2G

The 5SGXMA7H3F35C2G is a Stratix V GX field-programmable gate array (FPGA) optimized for high-density, high-throughput designs. Built on the Stratix V GX architecture, this commercial-grade device delivers 622,000 logic elements and approximately 51.2 Mbits of embedded memory to support complex digital logic, buffering and on-chip data storage.

With 552 user I/Os, support for Stratix V GX transceiver speed grades documented in the device family datasheet, and a compact 1152-BBGA (35 × 35 mm) FCBGA package, this FPGA targets applications that require significant logic resources, extensive I/O connectivity, and integrated high-speed switching capabilities while operating within a commercial temperature range.

Key Features

• Core & Logic  622,000 logic elements provide substantial programmable logic capacity for large-scale state machines, datapath logic and custom accelerators.
• Embedded Memory  Approximately 51.2 Mbits of on-chip RAM to support buffering, FIFOs, and embedded data structures without external memory for many functions.
• I/O & Periphery  552 user I/Os enable broad external device interfacing and multi-channel connectivity for complex system integration.
• High‑Speed Transceiver Support  Part of the Stratix V GX family, which includes documented transceiver speed grades in the device datasheet to address high-speed serial link requirements.
• Power & Voltage  Core voltage supply range specified at 870 mV to 930 mV for defined operating power conditions.
• Package & Mounting  1152-BBGA (FCBGA) 35 × 35 mm package, surface-mount mounting type suitable for dense board-level integration.
• Temperature & Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant for regulatory and environmental considerations.

Typical Applications

• High‑speed serial communications  Use the Stratix V GX transceiver capability and abundant I/O to implement multi‑channel serial links and protocol bridging.
• Packet processing and network infrastructure  Large logic capacity and on-chip RAM enable packet parsing, buffering and custom switching logic for network appliances.
• Data path acceleration  Implement custom datapaths, hardware accelerators and signal-processing pipelines using the available logic elements and embedded memory.
• System integration and prototyping  High I/O count and dense package make this device suitable for consolidating peripherals and prototyping complex SoC functions on a single FPGA.

Unique Advantages

• High logic density: 622,000 logic elements enable large, complex designs without partitioning across multiple devices.
• Substantial on‑chip memory: Approximately 51.2 Mbits of embedded RAM reduces reliance on external memory for many buffering and storage tasks.
• Broad I/O connectivity: 552 user I/Os support extensive peripheral interfaces and multi-channel sensor or data interfaces.
• Compact, production-ready package: 1152-BBGA FCBGA (35 × 35 mm) package supports high-density board integration while maintaining a surface-mount form factor.
• Commercial operating range: Specified for 0 °C to 85 °C, aligning with many commercial electronics deployments.
• Standards-conscious compliance: RoHS compliance supports environmentally conscious manufacturing and procurement.

Why Choose 5SGXMA7H3F35C2G?

This Stratix V GX FPGA combines a very large logic fabric with significant on-chip memory and a high I/O count in a compact 1152‑BBGA package, making it a strong option for designers building high-throughput, logic‑intensive systems. Its Stratix V GX family characteristics—documented transceiver capabilities and detailed electrical/switching specifications in the device datasheet—help system architects design for defined high-speed interfaces and predictable performance within commercial temperature and voltage ranges.

Choose the 5SGXMA7H3F35C2G when your project requires dense programmable logic, substantial embedded memory, and extensive I/O connectivity in a commercially rated FPGA with RoHS compliance and a production-oriented package footprint.

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