5SGXMA7H3F35C2LG

The 5SGXMA7H3F35C2LG is a Stratix V GX field programmable gate array (FPGA) device supplied in a 1152-ball BGA FCBGA package. This commercial-grade FPGA provides large logic capacity, substantial on-chip memory, and extensive I/O to address high-density digital logic and system integration tasks.

Designed for applications that require large-scale programmable logic and significant I/O bandwidth, the device pairs 622,000 logic elements with approximately 51.2 Mbits of embedded memory and 552 I/O pins, enabling complex custom logic, data buffering, and wide interfacing in a single silicon device.

Key Features

• Core Logic 622,000 logic elements (cells) to implement large, complex digital designs and custom processing pipelines.
• Embedded Memory Approximately 51.2 Mbits of on-chip RAM for data storage, buffering, and memory-intensive algorithms.
• I/O Capacity 552 user I/O pins to support dense external interfacing and multi-channel connectivity.
• Package and Mounting 1152-BBGA, FCBGA package (supplier device package: 1152-FBGA, 35×35) with surface-mount mounting for compact board-level integration.
• Power and Voltage Core voltage supply range of 820 mV to 880 mV, enabling defined core-power provisioning in system power architectures.
• Operating Temperature Commercial temperature grade rated from 0 °C to 85 °C for standard commercial environments.
• Standards Compliance RoHS compliant, supporting environmental and materials requirements for commercial electronics.

Typical Applications

• High-density digital systems — Deploy complex, large-scale custom logic functions that require hundreds of thousands of logic elements and sizable on-chip RAM.
• Data aggregation and buffering — Use the substantial embedded memory and wide I/O count to implement high-channel buffering, packet staging, or local data storage.
• System integration and prototyping — Integrate multiple digital subsystems onto a single FPGA platform to accelerate development and consolidate board-level components.

Unique Advantages

• High logic density: 622,000 logic elements enable implementation of large, feature-rich designs without partitioning across multiple devices.
• Significant on-chip memory: Approximately 51.2 Mbits of embedded RAM reduces reliance on external memory for many data-intensive functions.
• Extensive I/O: 552 I/O pins allow broad connectivity for multi-channel interfaces and complex peripheral integration.
• Compact BGA package: 1152-ball FCBGA footprint (35×35) supports high-density PCB layouts while providing reliable surface-mount assembly.
• Commercial-grade operating range: Rated 0 °C to 85 °C for deployments in commercial environments with defined thermal envelopes.
• RoHS compliant: Meets common environmental materials standards for modern electronic products.

Why Choose 5SGXMA7H3F35C2LG?

The 5SGXMA7H3F35C2LG positions itself as a high-capacity Stratix V GX FPGA option for designers who need a single-device solution combining large logic resources, substantial embedded memory, and broad I/O. Its commercial-grade rating, defined core voltage range, and compact 1152-ball FCBGA package make it suitable for dense board-level implementations where performance, integration, and predictable operating conditions are required.

For teams building compute-dense logic, memory-centric accelerators, or multi-interface systems, this device provides a balanced combination of resources that supports scalable designs and streamlined BOMs while aligning with RoHS material requirements.

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