5SGXMA7K1F35C2LN

The 5SGXMA7K1F35C2LN is a Stratix V GX Field Programmable Gate Array (FPGA) from Intel, delivered in a high-density 1152-ball FCBGA package. It combines large on-chip memory and extensive logic resources with a 432-pin I/O footprint to address designs that require substantial logic capacity and I/O connectivity.

Built for commercial-grade applications, this device targets systems that need high logic density, significant embedded memory, and a compact BGA package while operating within a low-voltage core supply range.

Key Features

• Logic Resources — 622,000 logic elements provide a high-density fabric for implementing complex digital designs and large-scale logic functions.
• Embedded Memory — Approximately 51.2 Mbits of on-chip RAM to support large data buffers, FIFOs, and on-chip storage for high-throughput processing.
• High I/O Count — 432 I/O pins to support wide external interfaces and multiple parallel data channels.
• Package & Mounting — 1152-BBGA, FCBGA package supplied as 1152-FBGA (35×35) for compact, surface-mount board designs.
• Power — Core voltage supply specified from 820 mV to 880 mV to match low-voltage system power domains.
• Temperature & Grade — Commercial grade with an operating temperature range of 0 °C to 85 °C for standard commercial deployments.
• Regulatory — RoHS compliant, meeting common environmental requirements for lead-free assembly.

Typical Applications

• High-density I/O systems — Use the 432 I/Os to interface with wide parallel buses, multi-lane ADC/DAC arrays, or multi-channel sensor networks.
• Memory-heavy logic — Leverage approximately 51.2 Mbits of embedded RAM for buffering, packet stores, and on-chip data management in throughput-critical designs.
• Compute and acceleration — Deploy the large logic resource pool for custom hardware accelerators, data-path processing, and algorithm offload.
• Compact system integration — The 1152-ball FCBGA package supports dense board layouts where PCB real estate and high pin count are required.

Unique Advantages

• Substantial on-chip capacity: Large logic element count and embedded RAM reduce reliance on external memory and discrete logic, simplifying system BOM.
• High I/O scalability: 432 I/Os enable broad connectivity options for complex multi-interface systems without custom IO expanders.
• Compact, industry-standard packaging: 1152-FBGA (35×35) FCBGA offers a space-efficient solution for high-pin-count designs and automated surface-mount assembly.
• Low-voltage core operation: 820–880 mV core supply aligns with modern low-power design domains and supports power-optimized system architectures.
• Commercial deployment-ready: Specified commercial temperature range and RoHS compliance simplify qualification for mainstream electronics products.

Why Choose 5SGXMA7K1F35C2LN?

The 5SGXMA7K1F35C2LN positions itself as a high-density, memory-rich Stratix V GX FPGA suited for commercial applications where logic capacity, on-chip memory, and extensive I/O are primary design drivers. Its combination of 622,000 logic elements, approximately 51.2 Mbits of embedded RAM, and 432 I/Os in a compact 1152-BBGA package enables designers to consolidate functionality, reduce external components, and simplify board-level integration.

This device is appropriate for engineering teams developing complex digital systems that require substantial on-chip resources while operating within standard commercial temperature and voltage ranges. Its Intel Stratix V GX lineage and published electrical characteristics offer a clear specification baseline for design planning and system integration.

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