5SGXMA7K1F35I2G

The 5SGXMA7K1F35I2G is a Stratix V GX FPGA in a 1152-BBGA (35×35) FCBGA package designed for industrial-grade, high-density programmable logic applications. It provides a large logic fabric and on-chip memory suitable for complex digital signal processing, high-bandwidth I/O aggregation, and system integration tasks.

This device targets designs that require substantial logic capacity, abundant embedded memory, and a high I/O count while operating across an industrial temperature range and a specified core voltage window.

Key Features

• Logic Capacity  Provides 622,000 logic elements for implementing large-scale digital designs and complex algorithms.
• Embedded Memory  Approximately 51.2 Mbits of embedded memory to support buffering, on-chip data storage, and DSP architectures.
• I/O Resources  432 user I/O pins to support dense interface connectivity and multiple parallel buses or high-pin-count interfaces.
• Transceiver Capability (Series)  Stratix V GX devices include transceiver speed grades in the device family; some GX speed grades support channel rates up to 14.1 Gbps as defined in the series datasheet.
• Power Supply  Core voltage supply range of 870 mV to 930 mV for the device core operating conditions.
• Package & Mounting  1152-BBGA FCBGA package (supplier package: 1152-FBGA, 35×35); surface-mount mounting type suitable for standard PCB assembly.
• Temperature Grade  Industrial-grade device with an operating temperature range of –40 °C to 100 °C for robust field operation.
• Standards & Compliance  RoHS compliant to meet environmental requirements.

Typical Applications

• High-Performance Networking  Use the high logic count, embedded memory, and series transceiver capabilities for packet processing, switching fabrics, and line cards.
• Signal Processing & Communications  Leverage the large logic array and on-chip RAM for DSP pipelines, FEC engines, and protocol offload tasks.
• Data Center & Storage  Implement custom accelerators, data movers, and interface bridging functions that require high I/O density and sizable on-chip memory.

Unique Advantages

• High Integration Density:  622,000 logic elements and substantial embedded memory reduce the need for external logic and memory components.
• Robust I/O Count:  432 I/O pins simplify integration of multiple parallel interfaces and high-pin-count peripherals without multiplexing compromises.
• Industrial Temperature Operation:  Rated for –40 °C to 100 °C to support deployment in demanding environmental conditions.
• Compact, Assembly-Friendly Package:  1152-BBGA (35×35) FCBGA package supports high-density PCB designs and surface-mount assembly processes.
• Regulatory Compliance:  RoHS compliance supports environmentally regulated product designs.

Why Choose 5SGXMA7K1F35I2G?

The 5SGXMA7K1F35I2G combines a very large logic fabric with substantial on-chip memory, extensive I/O, and an industrial operating range—making it well suited for demanding applications that require integration of compute, buffering, and high-density interfaces. Its FCBGA footprint and surface-mount mounting enable compact system-level designs while maintaining assembly compatibility.

This device is appropriate for engineering teams building high-throughput communications, advanced signal processing, or data-path acceleration solutions that need a reliable, high-capacity FPGA platform with verifiable electrical and thermal operating parameters.

Request a quote or submit a purchase inquiry to receive pricing and availability for the 5SGXMA7K1F35I2G Stratix V GX FPGA.