5SGXMA7K1F40C1N

The 5SGXMA7K1F40C1N is a Stratix® V GX field programmable gate array (FPGA) IC from Intel, delivering high-density programmable logic and on-chip memory in a 1517-BBGA FCBGA package. With 622,000 logic elements, approximately 51.2 Mbits of embedded memory and 696 user I/Os, this device targets designs that require substantial logic capacity and extensive I/O integration.

Designed as a commercial-grade FPGA, the device operates within a core supply range of 870 mV to 930 mV and an ambient temperature range of 0 °C to 85 °C, making it appropriate for a wide range of commercial electronic applications that demand high integration and configurable logic resources.

Key Features

• High-density logic – 622,000 logic elements to implement large-scale digital designs and complex algorithms.
• Embedded memory – Approximately 51.2 Mbits of on-chip RAM for data buffering, queues, and state storage without external memory dependency.
• Extensive I/O – 696 user I/O pins to support wide parallel buses, multiple peripherals, and dense system interfaces.
• Package and mounting – 1517-BBGA (FCBGA) package, supplier package 1517-FBGA (40×40), optimized for surface-mount assembly.
• Power and supply – Core operating voltage range of 870 mV to 930 mV to match system power-rail designs requiring low-voltage FPGA cores.
• Commercial temperature grade – Rated for 0 °C to 85 °C ambient operation for standard commercial deployments.
• Regulatory status – RoHS compliant to support lead-free assembly and regulatory requirements.

Typical Applications

• Custom digital systems – Implement complex, user-defined logic and state machines where high logic density and on-chip memory simplify system architecture.
• High‑I/O interface hubs – Aggregate and bridge multiple parallel and serial interfaces using the device’s large I/O count.
• Data buffering and packet processing – Use the substantial embedded RAM to implement FIFOs, packet queues, and intermediate data storage.

Unique Advantages

• Massive logic capacity: 622,000 logic elements provide the headroom for large, multi-function designs without partitioning across multiple devices.
• On-chip memory scale: Approximately 51.2 Mbits of embedded RAM reduces reliance on external memory, lowering BOM complexity and board area.
• Broad I/O availability: 696 I/O pins allow dense peripheral connectivity and flexible board-level partitioning.
• Surface-mount FCBGA package: The 1517-BBGA package supports compact, board-level integration for space-constrained systems.
• Commercial-grade qualification: Rated for 0 °C to 85 °C operation to match standard commercial electronics environments.
• RoHS compliant: Supports lead‑free manufacturing flows and regulatory requirements.

Why Choose 5SGXMA7K1F40C1N?

The 5SGXMA7K1F40C1N combines very large logic density, substantial embedded memory, and high I/O capacity in a single Stratix® V GX FCBGA package—making it a strong option for commercial designs that require consolidated, programmable logic and significant on-chip resources. Its electrical specifications and RoHS compliance support deployment in mainstream electronic products where integration and predictable operating conditions matter.

This device is suited to engineering teams and system designers seeking a high-density FPGA solution that reduces external component count while providing the I/O and memory resources necessary for complex digital subsystems. The Stratix V family datasheet provides additional series-level electrical and timing characteristics for integration and design planning.

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